Abstract: A display device includes: a first layer including a pixel array disposed on a base substrate, a side terminal disposed on the base substrate, and a transfer wiring electrically connected to the side terminal and the pixel array; a second layer coupled with the first layer; a seal disposed between the first layer and the second layer and surrounding the pixel array; a filler, spaced apart from the seal, overlapping at least a portion of the side terminal and filling a space between the first layer and the second layer; and a conductive connection pad disposed on a side surface of the first layer and contacting the side terminal.

Abstract: A semiconductor device structure, for example a 3D structure, and a method for fabricating a semiconductor device. As non-limiting examples, various aspects of this disclosure provide various semiconductor package structures, and methods for manufacturing thereof, that comprise interposer, interlayer, and/or heat dissipater configurations that provide for low cost, increased manufacturability, and high reliability.

Abstract: A display device includes a first conductive pattern layer connected to a signal line, a second conductive pattern layer connected to the first conductive pattern layer, and an insulation pattern layer disposed between the signal line and the second conductive pattern layer and overlapping the second conductive pattern layer. The second conductive pattern layer exposes a portion of an upper surface and a side surface of the insulation pattern layer. The second conductive pattern layer includes first and second edge portions disposed on the upper surface of the insulation pattern layer and facing each other in a second direction intersecting a first direction. A distance between the first and second edge portions decreases as moving along the first direction in a first region of the upper surface of the insulation pattern layer, and increases as moving along the first direction in a second region of the upper surface.

Abstract: A display device includes a substrate including a display area and a pad area. A plurality of pad electrodes is disposed in the pad area on the substrate. A plurality of elastic protrusions including a plurality of first elastic protrusions is disposed on each of the pad electrodes and a plurality of second elastic protrusions is disposed between the pad electrodes on substrate, in a plan view. A conductive layer is disposed on each of the first elastic protrusions. A driving chip overlaps the pad area and includes a base portion facing the substrate and a plurality of bump electrodes attached to one surface of the base portion and overlapping the pad electrodes, respectively.

Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

Abstract: A display device according to an embodiment includes a first substrate including a connection line; a second substrate facing the first substrate; and a connection pad connected to a side of surface of the first substrate and a side surface of the second substrate, wherein the connection pad includes a first portion contacting the side of the first substrate and the side surface of the second substrate, and a second portion that is disposed in each of the first substrate and the second substrate and contacting the connection wiring.

Abstract: According to an embodiment, both the high-speed communication and the low-speed communication are performed using a single communication line, thereby reducing limitations on wiring on a PCB and increasing the utilization efficiency of a transmission line.

Abstract: A display device includes a base layer, a pixel disposed on the base layer, a signal line electrically connected to the pixel, a signal pad connected to the signal line, and a plurality of insulating layers disposed on the base layer. The signal pad includes a first conductive pattern connected to an end portion of the signal line, a second conductive pattern connected to the first conductive pattern, and at least one insulating pattern disposed between the end portion of the signal line and the second conductive pattern in a cross-sectional view and overlapping the second conductive pattern in a plan view.

Abstract: A display device includes: a first substrate; a second substrate; first signal lines on the first substrate; second signal lines on the second substrate; first lateral wires on a lateral side of a first edge of the first substrate, and connected to end portions of the first signal lines; and second lateral wires on a lateral side of a second edge of the second substrate, and connected to end portions of the second signal lines. The first and second lateral wires are located in at least one first region and at least one second region, the at least one first region and the at least one second region being spaced from each other on the lateral sides of the first substrate and the second substrate. The at least one first region includes the first lateral wires, and the at least one second region includes the second lateral wires.

Abstract: A display device includes: a base layer comprising a top surface, a bottom surface opposite the top surface, and a plurality of side surfaces connecting the top surface and the bottom surface, wherein a display area and a non-display area adjacent to the display area are defined; an outer line overlapping the non-display area, on the top surface, and adjacent to any one of the plurality of side surfaces; a light emitting element layer overlapping the display area, on the top surface, and comprising a light emitting element; and a connection line connecting the outer line and the light emitting element, wherein the outer line comprises a center line extending from the connection line in a first direction and a branch line extending from the center line in a second direction crossing the first direction.

Abstract: A display device according to an embodiment includes a first substrate including a connection line; a second substrate facing the first substrate; and a connection pad connected to a side of surface of the first substrate and a side surface of the second substrate, wherein the connection pad includes a first portion contacting the side of the first substrate and the side surface of the second substrate, and a second portion that is disposed in each of the first substrate and the second substrate and contacting the connection wiring.

Abstract: Modifications to interleukin-2 alpha receptors are disclosed. Interleukin-2 analogs with increased binding affinity for interleukin-2 beta receptors are disclosed.

Abstract: A method of fabricating a printed circuit film including the steps of preparing a base film, and a plurality of lead wires disposed on the base film, the plurality of lead wires spaced apart from each other in a first direction and extending in a second direction intersecting the first direction, and forming a bonding member including a conductive member disposed to overlap a central portion of each of the plurality of lead wires, a first non-conductive member disposed to overlap a first portion of the plurality of lead wires in the second direction, and a second non-conductive member disposed to overlap a second portion of the plurality of lead wires in the second direction.

Abstract: A display device includes: a first substrate; a second substrate; first signal lines on the first substrate; second signal lines on the second substrate; first lateral wires on a lateral side of a first edge of the first substrate, and connected to end portions of the first signal lines; and second lateral wires on a lateral side of a second edge of the second substrate, and connected to end portions of the second signal lines. The first and second lateral wires are located in at least one first region and at least one second region, the at least one first region and the at least one second region being spaced from each other on the lateral sides of the first substrate and the second substrate. The at least one first region includes the first lateral wires, and the at least one second region includes the second lateral wires.

Abstract: The present invention relates to changes in interleukin-2 alpha receptors and interleukin-2 analogs with increased binding affinity for interleukin-2 beta receptors.

Abstract: A system and method for laser assisted bonding of semiconductor die. As non-limiting examples, various aspects of this disclosure provide systems and methods that enhance or control laser irradiation of a semiconductor die, for example spatially and/or temporally, to improve bonding of the semiconductor die to a substrate.

Abstract: A printed circuit film includes: a base film including a first film portion extending in a first direction, a second film portion extending in the first direction, and a third film portion extending in the first direction; a plurality of lead wires extending in the second direction and disposed on the first, second, and third film portions, the plurality of lead wires being spaced apart from each other in the first direction; and a bonding member including: a conductive member disposed to overlap the plurality of lead wires on the first film portion; a first non-conductive member disposed to overlap the plurality of lead wires and the second film portion; and a second non-conductive member disposed to overlap the plurality of lead wires and the third film portion, wherein the conductive member is disposed between the first non-conductive member and the second non-conductive member in the second direction.

Abstract: A display device includes: a base layer comprising a top surface, a bottom surface opposite the top surface, and a plurality of side surfaces connecting the top surface and the bottom surface, wherein a display area and a non-display area adjacent to the display area are defined; an outer line overlapping the non-display area, on the top surface, and adjacent to any one of the plurality of side surfaces; a light emitting element layer overlapping the display area, on the top surface, and comprising a light emitting element; and a connection line connecting the outer line and the light emitting element, wherein the outer line comprises a center line extending from the connection line in a first direction and a branch line extending from the center line in a second direction crossing the first direction.

Abstract: A display device includes an array substrate including a pixel array disposed on a base substrate, a side terminal disposed on the base substrate, and a transfer wiring electrically connected to the side terminal and the pixel array, the array substrate having an inclined side surface, and a conductive connection pad including a first portion disposed on the inclined side surface of the array substrate to contact the side terminal and a second portion disposed on a lower surface of the array substrate. The first portion and the second portion are connected to each other.

Abstract: A display device includes a base layer, a pixel disposed on the base layer, a signal line electrically connected to the pixel, a signal pad connected to the signal line, and a plurality of insulating layers disposed on the base layer. The signal pad includes a first conductive pattern connected to an end portion of the signal line, a second conductive pattern connected to the first conductive pattern, and at least one insulating pattern disposed between the end portion of the signal line and the second conductive pattern in a cross-sectional view and overlapping the second conductive pattern in a plan view.