Patents by Inventor Soo San Yong

Soo San Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7261230
    Abstract: An improved method of bonding an insulated wire (14) that has one end connected to a first bond pad (16) to a second bond pad (18) includes moving a tip of a capillary (20) holding the bond wire (14) over the surface of the second bond pad (18) such that the bond wire (14) is rubbed between the capillary tip (20) and the second bond pad (18), which tears the bond wire insulation so that at least a portion of a metal core of the wire (14) contacts the second bond pad (18). The wire (14) is then bonded to the second pad (18) using thermocompression bonding. The tip of the capillary (20) is roughened to enhance the tearing of the bond wire insulation.
    Type: Grant
    Filed: August 29, 2003
    Date of Patent: August 28, 2007
    Assignee: Freescale Semiconductor, Inc.
    Inventors: Fuaida Harun, Chiaw Mong Chan, Lan Chu Tan, Lau Teck Beng, Kong Bee Tiu, Soo San Yong