Patents by Inventor Soo-Tae Chae

Soo-Tae Chae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6851100
    Abstract: An integrated management system is provided for automatically executing a procedure of reviewing and editing an assembly reference and a bonding specification used for manufacturing IC packages. The system includes a drawing management system (DMS) that creates the assembly reference, and a bonding specification drawing system that creates, based on the assembly reference, the bonding specification. The integrated management system further includes a DMS database server that stores and manages the assembly reference and the bonding specification, a DMS file server that manages a blank diagram, a package outline, a bonding diagram, and a standard file, and a DMS web server that provides a web interface to a user for permitting a remote access. In particular, the drawing management system has a bonding rule check module that verifies whether the bonding specification meets a bonding rule suitable for an automated wire bonding process.
    Type: Grant
    Filed: March 11, 2003
    Date of Patent: February 1, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yean-Sang You, Heui-Seog Kim, Soo-Tae Chae