Abstract: A method for testing a sample for ball dent properties is provided. The method comprises disposing a sample on a stage of a testing apparatus and moving a trigger assembly that contains a tip having a radiused terminus toward the sample such that the terminus impacts the sample one or more times.

Abstract: The present invention relates to a medium composition for preparing an intestinal organoid. In addition, the present invention relates to: a method for preparing an intestinal organoid, comprising a step of culturing using the medium composition; and an intestinal organoid prepared by the preparation method. The medium for preparing an intestinal organoid can promote the proliferation of the intestinal organoid and maintain the stemness of the intestinal organoid. Therefore, the medium can be used in preparing a large amount of intestinal organoids of excellent quality, and intestinal organoids prepared using the medium can be used as agents for preventing or treating intestine-associated diseases, alternatives to animal experimental models of intestine-associated diseases, and the like.

Abstract: A method for testing a sample for ball dent properties is provided. The method comprises disposing a sample on a stage of a testing apparatus and moving a trigger assembly that contains a tip having a radiused terminus toward the sample such that the terminus impacts the sample one or more times.

Abstract: A multi-layered composite comprising a substrate and a conductive film is provided. The substrate contains a polymer composition that contains a thermoplastic polymer having a deflection temperature under load of about 40° C. or more as determined in accordance with ISO 75-2:2013 at a load of 1.8 MPa. The conductive film contains a noble metal. The composite exhibits an electromagnetic interference shielding effectiveness of about 25 decibels or more as determined in accordance with ASTM D4935-18 at a frequency of 10 GHz and thickness of 3 millimeters.

Abstract: An electronic module that comprises a housing that receives at least one electronic component is disclosed. The housing contains a polymer composition that includes an electromagnetic interference filler distributed within a polymer matrix, wherein the electromagnetic interference filler includes a plurality of carbon fibers and the polymer matrix contains a thermoplastic polymer. Further, the composition exhibits an electromagnetic interference shielding effectiveness of about 30 decibels or more, as determined in accordance with ASTM D4935-18 at a frequency of 5 GHz and thickness of 1 millimeter, and an in-plane thermal conductivity of about 1 W/m-K or more, as determined in accordance with ASTM E 1461-13.