Patents by Inventor Sooin PARK

Sooin PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Underfill film for semiconductor package and method for manufacturing semiconductor package using the same
    Patent number: 11942336
    Abstract: An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: March 26, 2024
    Assignee: DOOSAN CORPORATION
    Inventors: Taejin Choi, Chunggu Lee, Sooin Park, Jungjin Lee
  • UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING SAME
    Publication number: 20230027838
    Abstract: An underfill film for a semiconductor package and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film is suitable for a semiconductor package, which, by including an adhesive layer having low lowest melt viscosity, can improve the connection reliability of a package by minimizing the formation of voids during semiconductor packaging.
    Type: Application
    Filed: December 4, 2020
    Publication date: January 26, 2023
    Applicant: DOOSAN CORPORATION
    Inventors: Taejin CHOI, Sooin PARK
  • UNDERFILL FILM FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME
    Publication number: 20220199430
    Abstract: An underfill film for semiconductor packages and a method for manufacturing a semiconductor package using the underfill film are disclosed. The underfill film includes an adhesive layer in which a melt viscosity and an onset temperature are adjusted to a predetermined range such that production efficiency may be improved by simplifying packaging process of the semiconductor packages. Also the underfill film and the manufacturing process may improve connection reliability of the package.
    Type: Application
    Filed: August 17, 2021
    Publication date: June 23, 2022
    Applicant: DOOSAN CORPORATION
    Inventors: Taejin CHOI, Chunggu LEE, Sooin PARK, Jungjin LEE