Patents by Inventor Soojin Choi

Soojin Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250056861
    Abstract: A semiconductor device includes a substrate including an active pattern, a channel pattern on the active pattern, the channel pattern including a plurality of semiconductor patterns that are spaced apart from each other, a source/drain pattern electrically connected to the plurality of semiconductor patterns, an inner gate electrode between adjacent first and second semiconductor patterns of the plurality of semiconductor patterns, an inner gate insulating layer between the inner gate electrode and the first and second semiconductor patterns, an inner high-k dielectric layer between the inner gate electrode and the inner gate insulating layer, and an inner spacer between the inner gate insulating layer and the source/drain pattern. As the inner gate insulating layer includes an inner gate spacer, the inner gate electrode may stably fill the inner gate space. As a result, the electrical characteristics of the semiconductor device may be improved.
    Type: Application
    Filed: February 21, 2024
    Publication date: February 13, 2025
    Inventors: SOOJIN JEONG, MYUNG GIL KANG, DONGWON KIM, BEOMJIN PARK, DONGSUK SHIN, HYUN-KWAN YU, WOOSUK CHOI, SEUNGPYO HONG
  • Publication number: 20250038255
    Abstract: Disclosed are an electrolyte for a lithium secondary battery and a lithium secondary battery including the same, the electrolyte including: a lithium salt; an organic solvent; and an additive, wherein the additive includes an isocyanate-based additive and a carbonate-based additive, wherein the ratio of the weight of the carbonate-based additive to the weight of the isocyanate-based additive is greater than 1.
    Type: Application
    Filed: December 29, 2021
    Publication date: January 30, 2025
    Inventors: Soojin Kim, Jinah Seo, Junyong Lee, Hyejeong Jeong, Olga TSAY, Sunjoo Choi, Sanghoon Kim, Yunhee Kim
  • Publication number: 20230252707
    Abstract: An apparatus that transfers object motion in a source space to a target space is provided. The apparatus defines a mapping function from the source space to the target space based on feature points of the object-positioned source space, and feature points of the object-represented target space; determines a target root position corresponding to a root position of the object based on the mapping function; determines a target direction corresponding to a direction of the object, based on the mapping function; determines a target main joint corresponding to a main joint of the object based on the mapping function; determines a target sub-joint excluding the target main joint in the target space based on unique joint information of the object; and generates data representing the object motion in the target space by modifying a pose of the object in the target space to match the target main joint.
    Type: Application
    Filed: November 4, 2022
    Publication date: August 10, 2023
    Applicants: Samsung Electronics Co., Ltd., Korea Advanced Institute of Science and Technology
    Inventors: Seokpyo HONG, Junyong NOH, Soojin CHOI, Chaelin KIM, Kyungmin CHO, Jiyeon KIM
  • Patent number: 6698646
    Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.
    Type: Grant
    Filed: September 11, 2002
    Date of Patent: March 2, 2004
    Assignee: Agilent Technologies, Inc.
    Inventors: Kim H Chen, Soojin Choi, Chun Yee Chan, Johnny Monis Nigos
  • Publication number: 20030006267
    Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.
    Type: Application
    Filed: June 14, 2001
    Publication date: January 9, 2003
    Inventors: Kim H. Chen, Soojin Choi, Chun Yee Chan, Johnny Monis Nigos
  • Publication number: 20030006271
    Abstract: The present invention is a method for bonding gold wire to gold bond pads at temperatures lower than 125 degrees Celsius, and more particularly at room temperature, defined to be 25 degrees Celsius. By applying compressive force and ultrasonic energy, an intermetallic bond can be formed between a gold wire and a gold bond pad without elevating the temperature. Furthermore, the present invention uses ultrasonic energy with frequencies low enough to be in the range of commercially available wire bonders.
    Type: Application
    Filed: September 11, 2002
    Publication date: January 9, 2003
    Inventors: Kim H. Chen, Soojin Choi, Chun Yee Chan, Johnny Monis Nigos