Abstract: A heat conversion device according to an embodiment of the present invention comprises: a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs which are electrically connected and arranged in an array; an insulating part disposed on one surface of the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a heat sink disposed on the insulating part; a fan disposed spaced a predetermined distance from the heat sink; and a plurality of fastening members having moduli of elasticity of 1*103 kgf/cm2 to 30*103 kgf/cm2 and fixing the heat sink and the fan.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: A heat conversion device according to an embodiment of the present invention comprises: a plurality of P-type thermoelectric legs and a plurality of N-type thermoelectric legs which are electrically connected and arranged in an array; an insulating part disposed on one surface of the plurality of P-type thermoelectric legs and the plurality of N-type thermoelectric legs; a heat sink disposed on the insulating part; a fan disposed spaced a predetermined distance from the heat sink; and a plurality of fastening members having moduli of elasticity of 1*103 kgf/cm2 to 30*103 kgf/cm2 and fixing the heat sink and the fan.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module, and may provide a thermoelectric element and a thermoelectric module having notably improved cooling capacity (Qc) and rate of temperature change (AT) to be provided by constructing the thermoelectric element by stacking unit members, each of which comprises a semiconductor layer on a substrate, thereby lowering thermal conductivity and raising electric conductivity.

Abstract: The embodiments of the present invention relate to a thermoelectric element and a thermoelectric module used for cooling, and the thermoelectric module can be made thin by having a first substrate and a second substrate with different surface areas to raise the heat-dissipation effectiveness.

Abstract: Provided is a heat conversion device, including: a unit thermoelectric module including a first semiconductor element and a second semiconductor element; and a heat conversion module performing heat conversion by coming into contact with the unit thermoelectric module, wherein the heat conversion module includes: a heat conversion substrate coming into direct contact with at least any one of one end and the other end of the first semiconductor element or the second semiconductor element; and a radiating unit disposed on the heat conversion substrate.

Abstract: Provided is a method of manufacturing a thermoelectric device, including: forming a base substrate formed of a main raw material composed of Bi2(SeXTe1-X)3; milling the base substrate; changing a combination composition of any one material selected from Bi, Se and Te in the base substrate; adding and mixing one or more materials selected from Ag, Au, Pt, Cu, Ni, and Al to and with the base substrate and milling them; and forming a thermoelectric semiconductor device by sintering the milled materials.

Abstract: Provided is a thermoelectric material including metal oxide powder and thermoelectric powder. Thus, an internal filling rate is improved so that a Peltier effect can be maximized according to the increase of electrical conductivity and a Seebeck coefficient and the reduction of thermal conductivity, thereby enabling the improvement of the figure of merit (ZT) of a thermoelectric element.