Abstract: A method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; coating a solder resist on the formed copper foil pattern, at a region other than the connecting area; plating a barrier layer on the copper foil pattern at the connecting area after the coating of the solder resist; and plating tin on the plated barrier layer plated, thereby forming a tin layer on the barrier layer. Another method for fabricating a tape substrate includes forming, on an insulating film, a copper foil pattern having a connecting area; plating a barrier layer over the formed copper foil pattern; plating tin over the barrier layer after the plating of the barrier layer, thereby forming a tin layer over the barrier layer; and coating a solder resist on the tin layer at a region other than the connecting area, after the formation of the tin layer.

Abstract: A tape substrate including an insulating film, a copper foil pattern formed on the insulating film at one side of the insulating film, and provided with a connecting area where an electronic element is to be mounted, a barrier layer plated on the copper foil pattern at the connecting area, and formed with a plurality of pores, and a tin layer plated on the barrier layer, and alloyed with a portion of the copper foil pattern corresponding to the connecting area, through the pores. A method for fabricating the tape substrate is also disclosed. In accordance with the invention, it is possible to reduce the time taken for the copper foil pattern to come into contact with the electroless tin plating solution used in the tin plating process, thereby preventing the copper component of the copper foil pattern from being eluted. Accordingly, there is no open-circuit fault caused by formation of pores.

Abstract: A tape substrate including an insulating film, a copper foil pattern formed on the insulating film at one side of the insulating film, and provided with a connecting area where an electronic element is to be mounted, a barrier layer plated on the copper foil pattern at the connecting area, and formed with a plurality of pores, and a tin layer plated on the barrier layer, and alloyed with a portion of the copper foil pattern corresponding to the connecting area, through the pores. A method for fabricating the tape substrate is also disclosed. In accordance with the invention, it is possible to reduce the time taken for the copper foil pattern to come into contact with the electroless tin plating solution used in the tin plating process, thereby preventing the copper component of the copper foil pattern from being eluted. Accordingly, there is no open-circuit fault caused by formation of pores.