Abstract: A mold assembly having a first mold half and a second mold half forms a cavity when the first and second mold halves are mated together. Pins or projections, which extend into the cavity, are provided by the mold halves. A semiconductor leadframe rests on the pins provided by the lower mold half and are spaced a short distance from the pins provided by the upper mold half. The pins from the lower mold half support the leadframe whereas the upper mold half pins restrict the movement of the leadframe during an encapsulating procedure. By shortening the pins from the upper mold half the entire upper surface of the leadframe is encapsulated. This eliminates the necessity of having to backfill the holes left in the encapsulating material after the encapsulating procedure.