Abstract: A display device includes: a substrate; a semiconductor on the substrate, and including a channel, a first region, and a second region; an auxiliary insulating layer on the semiconductor; a first auxiliary electrode on the auxiliary insulating layer, and overlapping with the first region of the semiconductor; a second auxiliary electrode on the auxiliary insulating layer, and overlapping with the second region of the semiconductor; a gate electrode on the auxiliary insulating layer, and overlapping with the channel of the semiconductor; a first electrode on the first auxiliary electrode, and connected to the first region of the semiconductor; and a second electrode on the second auxiliary electrode, and connected to the second region of the semiconductor.

Abstract: A transistor is disclosed that includes a substrate, an active layer, a gate electrode, a first electrode, a second electrode, and a first connection electrode. The active includes a first region, a second region, and a channel region between the first region and the second region. The gate electrode is disposed on the active layer and overlaps the channel region. The first electrode is disposed on the substrate and electrically connects to the first region. The second electrode is disposed on the substrate and electrically connects to the second region. The first connection electrode is disposed on the substrate and electrically connects the gate electrode and the second electrode.

Abstract: A display device includes: a first base on which a display area and a non-display area are defined; a light-emitting element on the first base and in the display area; a second base facing the first base and above the light-emitting element; a color filter on a surface of the second base that faces the first base and overlapping the light-emitting element; a wavelength conversion pattern on the color filter; a sealing member in the non-display area between the first base and the second base; and a sink pattern in the non-display area, wherein the sink pattern is between the sealing member and the display area when viewed from a plan view.

Abstract: Provided are a method of packaging an MEMS device in vacuum using an O-ring and a vacuum-packaged MEMS device manufactured by the same. The method includes preparing an upper substrate including a cavity and a lower substrate including the MEMS device and loading the upper and lower substrates into a vacuum chamber; aligning the lower and upper substrates by mounting an O-ring on a marginal portion of the MEMS device of the lower substrate; compressing the O-ring between the upper and lower substrates by applying a pressure between the upper and lower substrates; venting the vacuum chamber; and removing the pressure applied between the upper and lower substrates. In this method, the MEMS device can be packaged in vacuum using a simple process without causing outgassing and leakage from a cavity of the upper substrate.