Patents by Inventor Soon Cheol Jung

Soon Cheol Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component-embedded substrate
    Patent number: 11439021
    Abstract: An electronic component-embedded substrate includes a first core layer having a first through-hole, a first passive component disposed in the first through-hole, a second core layer disposed on the first core layer and having a second through-hole, a second passive component disposed in the second through-hole, an insulating material covering at least a portion of each of the first passive component and the second passive component and disposed in at least a portion of each of the first through-hole and the second through-hole, and a first wiring layer disposed on a level between the first passive component and the second passive component such that at least a portion of the first wiring layer is covered with the insulating material. The first passive component and the second passive component are connected to each other by the first wiring layer.
    Type: Grant
    Filed: November 11, 2020
    Date of Patent: September 6, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Koo Woong Jeong, Kyung Hwan Ko, Jung Hyun Cho, Chang Soo Woo, Soon Cheol Jung
  • ELECTRONIC COMPONENT-EMBEDDED SUBSTRATE
    Publication number: 20220007511
    Abstract: An electronic component-embedded substrate includes a first core layer having a first through-hole, a first passive component disposed in the first through-hole, a second core layer disposed on the first core layer and having a second through-hole, a second passive component disposed in the second through-hole, an insulating material covering at least a portion of each of the first passive component and the second passive component and disposed in at least a portion of each of the first through-hole and the second through-hole, and a first wiring layer disposed on a level between the first passive component and the second passive component such that at least a portion of the first wiring layer is covered with the insulating material. The first passive component and the second passive component are connected to each other by the first wiring layer.
    Type: Application
    Filed: November 11, 2020
    Publication date: January 6, 2022
    Inventors: Koo Woong Jeong, Kyung Hwan Ko, Jung Hyun Cho, Chang Soo Woo, Soon Cheol Jung