Patents by Inventor Soon Gyu HWANG

Soon Gyu HWANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 10950541
    Abstract: A semiconductor device includes a substrate, a first lower wiring line on the substrate, a first insulation layer on the first lower wiring line, a first dielectric barrier layer and a first etch stop layer sequentially stacked on the first insulation layer, a second insulation layer on the first etch stop layer, a first upper wiring line extending through the second insulation layer, the first etch stop layer, and the first dielectric barrier layer, and a first conductive via in the first insulation layer and electrically connecting the first lower wiring line and the first upper wiring line. An upper surface of the first conductive via protrudes above a lower surface of the first upper wiring line.
    Type: Grant
    Filed: June 14, 2019
    Date of Patent: March 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Soon Gyu Hwang, Kyoung Woo Lee, YoungWoo Cho, Il Sup Kim, Su Hyun Bark, Young-Ju Park, Jong Min Baek, Min Huh
  • SEMICONDUCTOR DEVICE
    Publication number: 20200219808
    Abstract: A semiconductor device includes a substrate, a first lower wiring line on the substrate, a first insulation layer on the first lower wiring line, a first dielectric barrier layer and a first etch stop layer sequentially stacked on the first insulation layer, a second insulation layer on the first etch stop layer, a first upper wiring line extending through the second insulation layer, the first etch stop layer, and the first dielectric barrier layer, and a first conductive via in the first insulation layer and electrically connecting the first lower wiring line and the first upper wiring line. An upper surface of the first conductive via protrudes above a lower surface of the first upper wiring line.
    Type: Application
    Filed: June 14, 2019
    Publication date: July 9, 2020
    Inventors: Soon Gyu HWANG, Kyoung Woo LEE, YoungWoo CHO, IL SUP KIM, Su Hyun BARK, Young-Ju PARK, Jong Min BAEK, Min HUH