Patents by Inventor Soon Ho Joeng

Soon Ho Joeng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • CONDUCTIVE ADHESIVE, METHOD FOR MANUFACTURING THE SAME, AND ELECTRONIC DEVICE INCLUDING THE SAME
    Publication number: 20120228560
    Abstract: The present invention relates to a conductive adhesive, a method for manufacturing the same, and an electronic device including the same. The conductive adhesive includes: a conductive particle; a low-melting alloy powder including an alloy including Sn and at least one material selected from the group consisting of Ag, Cu, Bi, Zn, In, and Pb; a nano powder; a first binder including a thermosetting resin; and a second binder including a rosin compound.
    Type: Application
    Filed: May 7, 2012
    Publication date: September 13, 2012
    Applicant: Duk San Tekopia Co., Ltd.
    Inventors: Yong Un Jang, Sung Chul Kim, Yong Cheol Chu, Seung Jun Jang, Yoon Sang Son, Soon Ho Joeng