Patents by Inventor Soon-Hong Pang

Soon-Hong Pang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition for Removing Polymer
    Publication number: 20230339843
    Abstract: Disclosed is a composition for removing polymers. The composition contains a fluorinated alkyl compound, a polar aprotic solvent, and an acyclic secondary or tertiary amine compound.
    Type: Application
    Filed: June 27, 2023
    Publication date: October 26, 2023
    Applicant: Dongwoo Fine-Chem Co., Ltd.
    Inventors: Soon-Hong Pang, Kyeong-Muk Choi, Han-Byeol Kang
  • Composition for removing polymer
    Patent number: 11739048
    Abstract: Disclosed is a composition for removing polymers. The composition contains a fluorinated alkyl compound, a polar aprotic solvent, and an acyclic secondary or tertiary amine compound.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: August 29, 2023
    Assignee: DONGWOO FINE-CHEM CO., LTD.
    Inventors: Soon-Hong Pang, Kyeong-Muk Choi, Han-Byeol Kang
  • PROCESS SOLUTION COMPOSITION FOR POLYMER TREATMENT
    Publication number: 20220298366
    Abstract: The present disclosure relates to a process solution composition for polymer treatment comprising: a fluorine compound; a ketone-based solvent; and a polar aprotic solvent, wherein the ketone-based solvent is one or more selected from the group consisting of compounds represented by Chemical Formula 1 or Chemical Formula 2, and has an effect capable of preventing damage to various types of metals while improving the power of removing an adhesive polymer remaining on the wafer circuit surface in a semiconductor manufacturing process.
    Type: Application
    Filed: March 10, 2022
    Publication date: September 22, 2022
    Inventors: Soon-Hong Pang, Han-Byeol Kang, Sung-Sik Kim, Tae-Hee Kim
  • PROCESS SOLUTION FOR POLYMER PROCESSING
    Publication number: 20220189760
    Abstract: The present disclosure relates to a process solution for polymer processing, containing a polar aprotic solvent, a fluorine-based compound, and a sulfur-containing compound. The process solution for polymer processing may have excellent storage stability and minimize damage to the metal layer while improving an ability to remove the adhesive polymer remaining on a circuit surface of a semiconductor wafer.
    Type: Application
    Filed: December 9, 2021
    Publication date: June 16, 2022
    Inventors: Soon-Hong Pang, Han-Byeol Kang, Sung-Sik Kim, Tae-Hee Kim
  • Composition for Removing Polymer
    Publication number: 20210300860
    Abstract: Disclosed is a composition for removing polymers. The composition contains a fluorinated alkyl compound, a polar aprotic solvent, and an acyclic secondary or tertiary amine compound.
    Type: Application
    Filed: March 10, 2021
    Publication date: September 30, 2021
    Applicant: Dongwoo Fine-Chem Co., Ltd.
    Inventors: Soon-Hong Pang, Kyeong-Muk Choi, Han-Byeol Kang