Patents by Inventor Soon Huat James Tan

Soon Huat James Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe enhancement and method of producing a multi-row semiconductor package
    Patent number: 7476569
    Abstract: A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. Also, the outer ends of the first leads form a first row along the edge of the package and the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other and an encapsulant covers at least a portion of the first and second leads.
    Type: Grant
    Filed: May 2, 2008
    Date of Patent: January 13, 2009
    Assignee: United Test and Assembly Center Ltd.
    Inventors: Danny Vallejo Retuta, Hien Boon Tan, Susanto Tanary, Anthony Yi Sheng Sun, Soon Huat James Tan
  • LEADFRAME ENHANCEMENT AND METHOD OF PRODUCING A MULTI-ROW SEMICONDUCTOR PACKAGE
    Publication number: 20080199985
    Abstract: A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. Also, the outer ends of the first leads form a first row along the edge of the package and the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other and an encapsulant covers at least a portion of the first and second leads.
    Type: Application
    Filed: May 2, 2008
    Publication date: August 21, 2008
    Inventors: Danny Vallejo Retuta, Hien Boon Tan, Susanto Tanary, Anthony Yi Sheng Sun, Soon Huat James Tan
  • Leadframe enhancement and method of producing a multi-row semiconductor package
    Patent number: 7375416
    Abstract: A semiconductor package includes a plurality of first leads, each with a top outer portion removed from the lead and an outer end, and a plurality of second leads, each with a bottom outer portion removed from the lead and an outer end. The first and second leads alternate with each other along an edge of the package. Also, the outer ends of the first leads form a first row along the edge of the package and the outer ends of the second leads form a second row along the edge of the package. In one embodiment, the first and second rows are parallel to each other and an encapsulant covers at least a portion of the first and second leads.
    Type: Grant
    Filed: April 19, 2006
    Date of Patent: May 20, 2008
    Assignee: United Test and Assembly Center Ltd.
    Inventors: Danny Vallejo Retuta, Hien Boon Tan, Susanto Tanary, Anthony Yi Sheng Sun, Soon Huat James Tan