Patents by Inventor Soon Ing Chew

Soon Ing Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9293407
    Abstract: A semiconductor package includes a baseplate having a die attach region and a peripheral region, a transistor die having a first terminal and a second terminal facing away from the baseplate, and a frame including an electrically insulative member having a first side attached to the peripheral region of the baseplate, a second side facing away from the baseplate, a first metallization at the first side of the insulative member and a second metallization at the second side of the insulative member. The insulative member extends outward beyond a lateral sidewall of the baseplate. The first metallization is attached to the part of the first side which extends outward beyond the lateral sidewall of the baseplate. The first and second metallizations are electrically connected at a region of the insulative member spaced apart from the lateral sidewall of the baseplate.
    Type: Grant
    Filed: November 3, 2014
    Date of Patent: March 22, 2016
    Assignee: Infineon Technologies AG
    Inventors: Alexander Komposch, Soon Ing Chew, Brian Condie
  • Patent number: 9209116
    Abstract: A semiconductor device package includes a solid metal base with a top surface and an electrically conductive chip mounting area on the top surface. First and second pairs of conductive leads are attached to the base and extend away from one another in opposite directions. First and second amplifiers are attached to the top surface and are electrically connected to the first and second pairs of leads. The first pair is separated from the second pair by a horizontal gap between inner edge sides of the leads. A reference line in the horizontal gap that extends perpendicular to edges of the base divides the chip mounting area into first and second chip mounting sections. An area of the first chip mounting section is smaller than an area of the second chip mounting section. The first and second leads have a smaller width than the third and fourth leads.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: December 8, 2015
    Assignee: Infineon Technologies AG
    Inventors: Alexander Komposch, Soon Ing Chew, Herman Hugo, Simon Ward
  • Publication number: 20150340306
    Abstract: A semiconductor device package includes a solid metal base with a top surface and an electrically conductive chip mounting area on the top surface. First and second pairs of conductive leads are attached to the base and extend away from one another in opposite directions. First and second amplifiers are attached to the top surface and are electrically connected to the first and second pairs of leads. The first pair is separated from the second pair by a horizontal gap between inner edge sides of the leads. A reference line in the horizontal gap that extends perpendicular to edges of the base divides the chip mounting area into first and second chip mounting sections. An area of the first chip mounting section is smaller than an area of the second chip mounting section. The first and second leads have a smaller width than the third and fourth leads.
    Type: Application
    Filed: June 5, 2014
    Publication date: November 26, 2015
    Inventors: Alexander Komposch, Soon Ing Chew, Herman Hugo, Simon Ward
  • Publication number: 20150048492
    Abstract: A semiconductor package includes a baseplate having a die attach region and a peripheral region, a transistor die having a first terminal attached to the die attach region, and a second terminal and a third terminal facing away from the baseplate, and a frame including an electrically insulative member having a first side attached to the peripheral region of the baseplate, a second side facing away from the baseplate, a first metallization at the first side of the insulative member and a second metallization at the second side of the insulative member. The insulative member extends outward beyond a lateral sidewall of the baseplate. The first metallization is attached to the part of the first side which extends outward beyond the lateral sidewall of the baseplate. The first and second metallizations are electrically connected at a region of the insulative member spaced apart from the lateral sidewall of the baseplate.
    Type: Application
    Filed: November 3, 2014
    Publication date: February 19, 2015
    Inventors: Alexander Komposch, Soon Ing Chew, Brian Condie
  • Patent number: 8907467
    Abstract: A semiconductor package includes a baseplate having a die attach region and a peripheral region, a transistor die having a first terminal attached to the die attach region, and a second terminal and a third terminal facing away from the baseplate, and a frame including an electrically insulative member having a first side attached to the peripheral region of the baseplate, a second side facing away from the baseplate, a first metallization at the first side of the insulative member and a second metallization at the second side of the insulative member. The insulative member extends outward beyond a lateral sidewall of the baseplate. The first metallization is attached to the part of the first side which extends outward beyond the lateral sidewall of the baseplate. The first and second metallizations are electrically connected at a region of the insulative member spaced apart from the lateral sidewall of the baseplate.
    Type: Grant
    Filed: March 28, 2012
    Date of Patent: December 9, 2014
    Assignee: Infineon Technologies AG
    Inventors: Alexander Komposch, Soon Ing Chew, Brian Condie
  • Patent number: 8604609
    Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.
    Type: Grant
    Filed: October 18, 2012
    Date of Patent: December 10, 2013
    Assignee: Infineon Technologies AG
    Inventors: Anwar A. Mohammed, Soon Ing Chew, Donald Fowlkes, Alexander Komposch, Benjamin Pain-Fong Law, Michael Opiz Real
  • Publication number: 20130256858
    Abstract: A semiconductor package includes a baseplate having a die attach region and a peripheral region, a transistor die having a first terminal attached to the die attach region, and a second terminal and a third terminal facing away from the baseplate, and a frame including an electrically insulative member having a first side attached to the peripheral region of the baseplate, a second side facing away from the baseplate, a first metallization at the first side of the insulative member and a second metallization at the second side of the insulative member. The insulative member extends outward beyond a lateral sidewall of the baseplate. The first metallization is attached to the part of the first side which extends outward beyond the lateral sidewall of the baseplate. The first and second metallizations are electrically connected at a region of the insulative member spaced apart from the lateral sidewall of the baseplate.
    Type: Application
    Filed: March 28, 2012
    Publication date: October 3, 2013
    Applicant: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
    Inventors: Alexander Komposch, Soon Ing Chew, Brian Condie
  • Patent number: 8314487
    Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.
    Type: Grant
    Filed: December 18, 2009
    Date of Patent: November 20, 2012
    Assignee: Infineon Technologies AG
    Inventors: Anwar A. Mohammed, Soon Ing Chew, Donald Fowlkes, Alexander Komposch, Benjamin Pain-Fong Law, Michael Opiz Real
  • Patent number: 8110445
    Abstract: According to an embodiment of a high power package, the package includes a copper heat sink, a ceramic lead frame and a semiconductor chip. The copper heat sink has a thermal conductivity of at least 350 W/mK. The ceramic lead frame is attached to the copper heat sink with an epoxy. The semiconductor chip is attached to the copper heat sink on the same side as the lead frame with an electrically conductive material having a melting point of about 280° C. or greater.
    Type: Grant
    Filed: May 6, 2009
    Date of Patent: February 7, 2012
    Assignee: Infineon Technologies AG
    Inventors: Anwar A. Mohammed, Soon Ing Chew, Donald Fowlkes
  • Patent number: 8110915
    Abstract: An RF semiconductor package includes a substrate having generally planar top and bottom surfaces. The substrate includes a metallic base region and one or more metallic signal terminal regions extending from the top surface to the bottom surface, and an insulative material separating the metallic regions from one another. The bottom surface of an RF semiconductor die is surface-mounted to the base region at the top substrate surface. The RF semiconductor die has a terminal pad disposed at a top surface of the RF semiconductor die. The terminal pad is electrically connected to one of the signal terminal regions at the top substrate surface. A lid is attached to the top substrate surface so that the RF semiconductor die is enclosed by the lid to form an open-cavity around the RF semiconductor die. The base and signal terminal regions are configured for surface-mounting at the bottom substrate surface.
    Type: Grant
    Filed: October 16, 2009
    Date of Patent: February 7, 2012
    Assignee: Infineon Technologies AG
    Inventors: Donald Fowlkes, Soon Ing Chew
  • Patent number: 8013429
    Abstract: An air cavity package is manufactured by attaching a die to a surface of a copper heat sink, dispensing a bead of epoxy around a periphery of the heat sink surface after the die is attached to the copper heat sink so that the bead of epoxy generally surrounds the die and placing a ceramic window frame on the bead of epoxy. The epoxy is cured to attach a bottom surface of the ceramic window frame to the copper heat sink.
    Type: Grant
    Filed: July 14, 2009
    Date of Patent: September 6, 2011
    Assignee: Infineon Technologies AG
    Inventors: Anwar A. Mohammed, Soon Ing Chew, Alexander Komposch, Christian Andrada
  • Publication number: 20110147921
    Abstract: A semiconductor package includes a curved body and a plurality of semiconductor die. The curved body includes first and second opposing end regions and an intermediate center region. The curved body has a first inflection point at the center region, a second inflection point at the first end region and a third inflection point at the second end region. The center region has a convex curvature with a minimal extremum at the first inflection point, the first end region has a concave curvature with a maximal extremum at the second inflection point and the second end region has a concave curvature with a maximal extremum at the third inflection point. The plurality of semiconductor die are attached to an upper surface of the curved body between the maximal extrema.
    Type: Application
    Filed: December 18, 2009
    Publication date: June 23, 2011
    Applicant: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
    Inventors: Anwar A. Mohammed, Soon Ing Chew, Donald Fowlkes, Alexander Komposch, Benjamin Pain-Fong Law, Michael Opiz Real
  • Publication number: 20110089529
    Abstract: An RF semiconductor package includes a substrate having generally planar top and bottom surfaces. The substrate includes a metallic base region and one or more metallic signal terminal regions extending from the top surface to the bottom surface, and an insulative material separating the metallic regions from one another. The bottom surface of an RF semiconductor die is surface-mounted to the base region at the top substrate surface. The RF semiconductor die has a terminal pad disposed at a top surface of the RF semiconductor die. The terminal pad is electrically connected to one of the signal terminal regions at the top substrate surface. A lid is attached to the top substrate surface so that the RF semiconductor die is enclosed by the lid to form an open-cavity around the RF semiconductor die. The base and signal terminal regions are configured for surface-mounting at the bottom substrate surface.
    Type: Application
    Filed: October 16, 2009
    Publication date: April 21, 2011
    Applicant: INFINEON TECHNOLOGIES NORTH AMERICA CORP.
    Inventors: Donald Fowlkes, Soon Ing Chew
  • Patent number: 7811862
    Abstract: According to one embodiment, an electronic package includes a semiconductor die, a heat sink and a metallization layer interposed between the semiconductor die and the heat sink. The metallization layer attaches the semiconductor die to the heat sink. The metallization layer has a thickness of about 5 ?m or less and a thermal conductivity of about 60 W/m·K or greater.
    Type: Grant
    Filed: December 17, 2008
    Date of Patent: October 12, 2010
    Assignee: Infineon Technologies AG
    Inventors: Anwar A. Mohammad, Soon Ing Chew