Abstract: Provided are methods and apparatuses for improving compression efficiency in directional intra-prediction. A video encoding apparatus, which does not need to record intra mode information, includes a mode selector that selects one from among a plurality of intra modes on the basis of a directionality of at least one neighboring block that has already been reconstructed before a current block is reconstructed, an intra predictor that obtains a prediction block of the current block from the at least one neighboring block according to the directionality of the selected mode, and obtains a residual block by subtracting the prediction block from the current block, and a unit for encoding the obtained residual block.

Abstract: Disclosed are a semiconductor device (1) including a MOSPET region and an integrated diode region, and a manufacturing method thereof. More particularly, a semiconductor device (1) including a silicon carbide (SiC) MOSPET region and an integrated Schottky bather diode that reduce forward voltage drop (Vf), device area, and switching oscillation resulting from parasitic inductance are disclosed.

Abstract: A paint composition contains bio-resin, which is eco-friendly and has improved chemical resistance that can impart excellent coating film physical properties, such as, adhesion, sun-cream resistance, chemical agent resistance, and fragrance resistance, by applying a bio-resin to the paint. The paint composition includes a bio-resin and an acrylic resin, and the bio-resin has a biocarbon content of 90 wt % or more as measured by ASTM D6866.

Abstract: The present invention relates to an undercoat paint composition comprising an acid-modified polyester resin, a pigment, and a solvent.

Abstract: Provided are a probe card, a test apparatus having the probe card, and a test method using the test apparatus. The probe card includes a probe substrate having a signal line, a probe needle connected to the signal line and fixed to the probe substrate, and a cooling unit for cooling the temperature of the probe needle. Therefore, the probe needles contacting each chip can be maintained at a certain low temperature without increasing the temperature. As a result, it is possible to pervent deformation of the probe needles and minimize an amount of impurities stuck to the probe needles.

Abstract: A wafer processing apparatus and a wafer processing method using the same are provided. A grinding wheel may include a wheel body having a plurality of wheel blades to remove a backside of a wafer, each of the plurality of wheel blades in an annular array with respect to each other and configured to move individually. A method of processing a wafer may include preparing a wafer for a backside processing, a first processing the backside of the wafer using a first wheel blade or a second wheel blade, and a second processing the backside of the wafer using only the second wheel blade.

Abstract: Provided are a probe card, a test apparatus having the probe card, and a test method using the test apparatus. The probe card includes a probe substrate having a signal line, a probe needle connected to the signal line and fixed to the probe substrate, and a cooling unit for cooling the temperature of the probe needle. Therefore, the probe needles contacting each chip can be maintained at a certain low temperature without increasing the temperature. As a result, it is possible to pervent deformation of the probe needles and minimize an amount of impurities stuck to the probe needles.

Abstract: A semiconductor exposure apparatus includes a light exposure portion irradiating light on a semiconductor wafer through a reticle; a pellicle particle detector detecting a particle existing on a surface of the reticle; a particle cleaner cleaning the reticle when the particle exists on the surface of the reticle; a robot arm moving the reticle to a desired location in response to a control signal generated from a main controller; and the main controller controlling an operation of the semiconductor exposure apparatus.

Abstract: A semiconductor exposure apparatus includes a light exposure portion irradiating light on a semiconductor wafer through a reticle; a pellicle particle detector detecting a particle existing on a surface of the reticle; a particle cleaner cleaning the reticle when the particle exists on the surface of the reticle; a robot arm moving the reticle to a desired location in response to a control signal generated from a main controller; and the main controller controlling an operation of the semiconductor exposure apparatus.

Abstract: The presence of particles on the wafer holder of semiconductor exposure equipment is detected by analyzing any up-and-down movement of the stage during the alignment, for exposure, of a wafer mounted on the wafer holder. The analysis of the up-and-down movement of the stage is conducted based on signals from a motor which moves the stage in the vertical (Z-axis) direction, or based on signals from a sensor indicative of the distance that the stage deviates vertically from a reference position. A feedback mechanism produces information representative of the up-and-down movement of the stage, and a computer processes the signals to produce data indicative of whether particles are present beneath the wafer on the stage.

Abstract: A vacuum adsorbing apparatus of a semiconductor fabrication facility is characterized by the incorporation of a digital vacuum sensor into the vacuum line for sensing the mounting state of a wafer or reticle on a mounting plate (adhered to or released by) by way of sensing the pressure existing in the vacuum line. The digital sensor reliably determines the state of the wafer or the reticle relative to the mounting plate. The mounting plate can thus be prevented from being transferred when the vacuum in the mounting plate is insufficient to adhere the wafer or reticle firmly to the plate. The wafer or the reticle can thus be prevented from being damaged or broken during its transfer.

Abstract: A chip leveling apparatus of wafer exposure equipment adjusts the diameter of the light incident on a wafer according to the chip size so that the inclination of that area can be accurately detected for use in leveling the wafer in preparation for exposure. A wafer leveling stage supports the wafer during its exposure. A stage driving mechanism can adjust the inclination of the wafer leveling stage relative to the horizontal. A light source produces a collimated beam of light which is directed towards the wafer exposure field at an acute angle. A location sensor is fixed in position to receive the light once the light has reflected from the exposure field, and thereby senses the inclination of the exposure field. A computer controller receives information from the sensor and controls the stage driving mechanism accordingly.

Abstract: A chemical spray system includes a nozzle assembly and a suction pipe in flow communication with the nozzle assembly. A waste liquid tank is in flow communication with the suction pipe. A first valve assembly is located in a flow path of the suction pipe between the nozzle and the waste liquid tank. A generator, located in the flow path of the suction pipe between the first valve assembly and the waste liquid tank, induces fluid flow from the first valve assembly to the waste liquid tank. The nozzle assembly is suctioned via the suction pipe when the first valve assembly is in an open position. A cleansing fluid supply assembly is in flow communication with the suction pipe between the first valve assembly and the generator. Thus, a chemical can be cleaned from the generator with cleansing fluid to prevent corrosion and failure of the generator in advance.

Abstract: A reference mark member used in exposure equipment is protected from being contaminated. A cover assembly, which includes a shutter-like cover, can be selectively opened and closed over the reference mark member to protect the same. A driving system drives the cover between its open and closed positions. An electronic controller controls the operation of the driving system based on the operating state of the equipment. The cover assembly may also include an annular support for the cover which extends around the reference mark member to offer further protection for the same. Protecting the reference mark member prevents the contamination of the reference mark which could lead to an error in an alignment task for which the reference mark is used.

Abstract: An apparatus and method for limiting double exposure in a stepper with a shutter that alternately passes and blocks a light beam for fabrication of semiconductor devices. The apparatus has a light sensor that detects light passed by the shutter and produces a sensing signal related to the light passed. A double exposure detector receives the sensing signal and produces an error signal related to the sensing signal. An exposure controller connected to the detector and connected to the shutter, receives the error signal and produces a shutter-driving control signal.