Abstract: A chemical mechanical polishing (CMP) apparatus includes a polishing pad, a platen, and a cleaning apparatus which provides a cleaning fluid for cleaning the polishing head. The cleaning apparatus includes a shaft located outside a periphery of the polishing pad, and an arm mounted to the shaft and extending over the polishing pad such that a bottom surface of the arm confronts the polishing surface of the polishing pad. Further, a cleaning fluid path is defined in the arm along a length of the arm, and first drop holes are defined in the arm which are fluidly connected to the cleaning fluid path and which drop cleaning fluid onto the polishing surface of the polishing pad.

Abstract: An improved view angle compensating apparatus for use with a monitor display is disclosed, in which the body of a monitor display is prevented from being disassembled from a monitor stand support when an excessive force is being applied thereto during a compensation period of a view angle.