Abstract: A method of manufacturing a three-dimensional (3D) semiconductor includes dividing each of a plurality of wafers into a plurality of multi-dies each including a plurality of dies; checking whether each of the dies has a defect; storing a result of checking whether each of the dies has a defect and information regarding each of the multi-dies; forming virtual combined structures by combining and stacking all the multi-dies in a predetermined number of layers; forming 3D semiconductor groups by calculating yields of the combined structures based on the result of checking whether each of the dies has a defect and the information regarding each of the multi-dies, selecting a combined structure having a highest yield from among the combined structures, and stacking the multi-dies to have the same structure as the selected combined structure; and forming a 3D semiconductor chip by dividing the 3D semiconductor groups in units of dies.

Abstract: A method of manufacturing a three-dimensional (3D) semiconductor includes dividing each of a plurality of wafers into a plurality of multi-dies each including a plurality of dies; checking whether each of the dies has a defect; storing a result of checking whether each of the dies has a defect and information regarding each of the multi-dies; forming virtual combined structures by combining and stacking all the multi-dies in a predetermined number of layers; forming 3D semiconductor groups by calculating yields of the combined structures based on the result of checking whether each of the dies has a defect and the information regarding each of the multi-dies, selecting a combined structure having a highest yield from among the combined structures, and stacking the multi-dies to have the same structure as the selected combined structure; and forming a 3D semiconductor chip by dividing the 3D semiconductor groups in units of dies.

Abstract: Provided is a method of inspecting a substrate. The method includes: receiving an image of a pad area of substrate; determining and registering a start point pixel; tracing pixels having the same gradation as the start point pixel; determining a boundary area; designating a direction code to next point pixel on the basis of a current point pixel; extracting maximum distance pixel coordinates; and detecting a defect of the pad area.

Abstract: Provided is a method of inspecting a substrate. The method includes: receiving an image of a pad area of substrate; determining and registering a start point pixel; tracing pixels having the same gradation as the start point pixel; determining a boundary area; designating a direction code to next point pixel on the basis of a current point pixel; extracting maximum distance pixel coordinates; and detecting a defect of the pad area.