Patents by Inventor Soon Kwang Kwon
Soon Kwang Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11935682Abstract: A coil component includes a body including magnetic metal powder and an insulating resin, an insulating substrate embedded in the body, a coil portion disposed on at least one side of the insulating substrate the body, and having a lead-out pattern exposed from one of end surfaces of the body opposing each other, an external insulating layer exposing the lead-out pattern while surrounding the body, and including a magnetic ceramic, and an external electrode disposed on the body, and connected to the lead-out pattern.Type: GrantFiled: September 10, 2019Date of Patent: March 19, 2024Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jin Jeon, Seon Woo Oh, Soon Kwang Kwon
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Publication number: 20230420177Abstract: A coil component includes a body including a first surface and a second surface opposing each other in a first direction, a third surface and a fourth surface opposing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface opposing each other in a third direction perpendicular to the first direction and the second direction, and including a recess in the third surface, a support member disposed in the body, a coil disposed on the support member and including first and second lead-out portions extending to the third surface of the body, and first and second external electrodes disposed on the sixth surface of the body, extending into the recess and connected to the first and second lead-out portions, respectively.Type: ApplicationFiled: January 17, 2023Publication date: December 28, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soon Kwang KWON, Tae Hyun KIM, Dong Hwan LEE, Byeong Cheol MOON, Boum Seock KIM
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Publication number: 20230395311Abstract: A coil component includes a body, a coil disposed within the body, a first insulating layer covering at least a portion of the coil, an external electrode disposed on one surface of the body and connected to the coil at the one surface of the body, and a magnetic layer disposed on the first insulating layer, covering at least a portion of the first insulating layer and spaced apart from the surface of the body, and in which an the external electrode is disposed on the body, connected to the coil, and spaced apart from the magnetic layer. Additionally, the coil component can include a second insulating layer covering at least a portion of the magnetic layer.Type: ApplicationFiled: January 3, 2023Publication date: December 7, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Tae Hyun KIM, Soon Kwang KWON, Dong Hwan LEE, Byeong Cheol MOON, Boum Seock KIM
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Patent number: 11830643Abstract: A coil electronic component includes a body including magnetic particles and an insulating resin, and a coil portion disposed within the body. The body has a multilayer structure including a core portion covering the coil portion and a cover portion covering the core portion. The magnetic particles included in the core portion have a distribution of a particle size having a D50 of 3.5 ?m or less.Type: GrantFiled: September 6, 2019Date of Patent: November 28, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Il Jin Park, Joong Won Park, Se Hyung Lee, Soon Kwang Kwon
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Patent number: 11763970Abstract: A coil electronic component includes a support substrate including a metal plate having a plurality of through-holes formed therein, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, an encapsulant disposed on at least a portion of the support substrate, the coil pattern, and at least a portion of the metal plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.Type: GrantFiled: January 22, 2020Date of Patent: September 19, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jin Jeon, Soon Kwang Kwon, Seon Woo Oh
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Patent number: 11657950Abstract: A coil component includes a body and a coil portion embedded in the body, wherein the body comprises a first magnetic metal powder particle comprising a core represented by Formula 1 below, and an oxide film comprising at least one of silicon (Si) and chromium (Cr) and formed on a surface of the core, a second magnetic metal powder particle having a larger diameter than the first magnetic metal powder particle, and a third magnetic metal powder particle having a larger diameter than the second magnetic metal powder particle: FeaSibCrc??[Formula 1] where 3 atom %?b?6 atom %, 2.65 atom %?c?3.65 atom %, and a+b+C=100.Type: GrantFiled: June 15, 2020Date of Patent: May 23, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Ok Jeon, Jeong Ho Lim, Il Jin Park, Soon Kwang Kwon, Gwang Hwan Hwang
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Patent number: 11581114Abstract: A magnetic powder contains a magnetic metal particle comprising iron (Fe) and an insulating coating layer disposed on a surface of the magnetic metal particle and comprising tin (Sn), phosphorous (P) and oxygen (O), and a coil component contains such a magnetic powder.Type: GrantFiled: May 20, 2020Date of Patent: February 14, 2023Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Il Jin Park, Jun Sung Lee, Joong Won Park, Gwang Hwan Hwang, Soon Kwang Kwon
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Patent number: 11538620Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region, an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.Type: GrantFiled: March 30, 2020Date of Patent: December 27, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Jin Jeon, Soon Kwang Kwon
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Publication number: 20220209308Abstract: A module battery system is disclosed and, more specifically, a module battery system which can select and output a desired capacity through a combination of a plurality of battery modules and notify the outside of an abnormal situation through a self-diagnosis and performs a self-protection operation as necessary at the same time.Type: ApplicationFiled: September 10, 2020Publication date: June 30, 2022Inventors: Sang Oog JEON, Seung Hyeon LEE, Soon Kwang KWON, Deuk Hyoun KOO
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Patent number: 11127517Abstract: A coil component includes a body having a winding type coil and a core in which the winding type coil is embedded, and external electrodes disposed on external surfaces of the body. The core includes first and second cores, and the first and second cores are coupled to each other with a bonding surface interposed therebetween. The bonding surface is formed of a same type of resin as the first and second cores. The first and second cores each include a resin directly covering surfaces of magnetic powder particles, such that adjacent particles are separated only by the resin. A method of manufacturing the coil component includes applying a solvent to dissolve a resin on a bonding surface of the first core, and mounting the second core to the bonding surface having the solvent applied thereto.Type: GrantFiled: August 9, 2018Date of Patent: September 21, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soon Kwang Kwon, Joong Won Park, Young Seuck Yoo
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Patent number: 11107614Abstract: A coil electronic component includes a body, a coil unit disposed in the body and having a multilayer structure. The coil unit includes a first coil pattern forming an upward turn with respect to a bottom surface of the body and a second coil pattern forming a downward turn with respect to the bottom surface of the body. The first and second coil patterns are disposed on at least two layers of the multilayer structure. The component additionally includes a first external electrode and a second external electrode disposed on the bottom surface of the body.Type: GrantFiled: August 30, 2018Date of Patent: August 31, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soon Kwang Kwon, Jung Ho Cho, Jung Wook Seo, Young Seuck Yoo, Joong Won Park
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Publication number: 20210225575Abstract: A coil component includes a body and a coil portion embedded in the body, wherein the body comprises a first magnetic metal powder particle comprising a core represented by Formula 1 below, and an oxide film comprising at least one of silicon (Si) and chromium (Cr) and formed on a surface of the core, a second magnetic metal powder particle having a larger diameter than the first magnetic metal powder particle, and a third magnetic metal powder particle having a larger diameter than the second magnetic metal powder particle: FeaSibCrc??[Formula 1] where 3 atom %?b?6 atom %, 2.65 atom %?c?3.65 atom %, and a+b+C=100.Type: ApplicationFiled: June 15, 2020Publication date: July 22, 2021Inventors: Jong Ok JEON, Jeong Ho LIM, Il Jin PARK, Soon Kwang KWON, Gwang Hwan HWANG
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Publication number: 20210217546Abstract: A magnetic powder contains a magnetic metal particle comprising iron (Fe) and an insulating coating layer disposed on a surface of the magnetic metal particle and comprising tin (Sn), phosphorous (P) and oxygen (O), and a coil component contains such a magnetic powder.Type: ApplicationFiled: May 20, 2020Publication date: July 15, 2021Inventors: Il Jin PARK, Jun Sung LEE, Joong Won PARK, Gwang Hwan HWANG, Soon Kwang KWON
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Patent number: 11056275Abstract: A coil electronic component includes a body including ferrite, a coil portion embedded in the body, external electrodes electrically connected to the coil portion, and a magnetic permeability adjusting layer disposed in the body and including ferrite having a Curie temperature lower than that of the ferrite included in the body.Type: GrantFiled: June 11, 2018Date of Patent: July 6, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soon Kwang Kwon, Young Seuck Yoo, Joong Won Park, Jung Wook Seo
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Patent number: 10957475Abstract: A hybrid coil component in which a magnetic core generally included in a wire-wound type inductor and a core included in a multilayer type inductor are combined with each other. A winding coil may be wound around a magnetic core manufactured in advance and an encapsulant having a stacked structure of a plurality of magnetic sheets may encapsulate the winding coil wound around the magnetic core. In this case, a magnetic flux generated in the winding coil is arranged to be parallel to long axes of magnetic particles contained in the magnetic core and the encapsulant.Type: GrantFiled: November 7, 2017Date of Patent: March 23, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soon Kwang Kwon, Young Seuck Yoo, Jung Wook Seo
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Publication number: 20210027926Abstract: A coil electronic component includes a support substrate including a metal plate having a plurality of through-holes formed therein, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, an encapsulant disposed on at least a portion of the support substrate, the coil pattern, and at least a portion of the metal plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.Type: ApplicationFiled: January 22, 2020Publication date: January 28, 2021Inventors: Hyung Jin Jeon, Soon Kwang Kwon, Seon Woo Oh
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Publication number: 20210027933Abstract: A coil electronic component includes a support substrate, a coil pattern disposed on at least a surface of the support substrate and having a core region in the center of the coil pattern, at least one metal thin plate disposed on an upper portion of the coil pattern and having a shape bent toward the core region, an encapsulant sealing at least a portion of the support substrate, the coil pattern, and the at least one metal thin plate, and an external electrode disposed outside of the encapsulant and connected to the coil pattern.Type: ApplicationFiled: March 30, 2020Publication date: January 28, 2021Inventors: Hyung Jin JEON, Soon Kwang KWON
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Publication number: 20200168375Abstract: A coil component includes a body having one surface and the other surface facing each other, and a plurality of wall surfaces connecting the one surface and the other surface, and having a distance from the one surface to the other surface of 0.65 mm or less (excluding 0 mm); and a coil portion embedded in the body, wherein the body comprises an Fe—Si—B—Nb—Cu-based metal magnetic powder particle represented by the following chemical formula 1, wherein the Fe—Si—B—Nb—Cu-based metal magnetic powder particle comprises a crystal grain of 20 nm or less (excluding 0 mm), FeaSibBcNbdCue??[Chemical Formula 1] (where 73 atom %?a?77 atom %, 10 atom %?b?14 atom %, 9 atom%?c?11 atom %, 2 atom %?d?3 atom %, 0.5 atom %?e?1 atom %, and a+b+c+d+e=100).Type: ApplicationFiled: September 10, 2019Publication date: May 28, 2020Inventors: Il Jin PARK, Gwang Hwan HWANG, Jun Sung LEE, Soon Kwang KWON
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Publication number: 20200143976Abstract: A coil component includes a body including magnetic metal powder and an insulating resin, an insulating substrate embedded in the body, a coil portion disposed on at least one side of the insulating substrate the body, and having a lead-out pattern exposed from one of end surfaces of the body opposing each other, an external insulating layer exposing the lead-out pattern while surrounding the body, and including a magnetic ceramic, and an external electrode disposed on the body, and connected to the lead-out pattern.Type: ApplicationFiled: September 10, 2019Publication date: May 7, 2020Inventors: Hyung Jin JEON, Seon Woo OH, Soon Kwang KWON
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Publication number: 20200143972Abstract: A coil electronic component includes a body including magnetic particles and an insulating resin, and a coil portion disposed within the body. The body has a multilayer structure including a core portion covering the coil portion and a cover portion covering the core portion. The magnetic particles included in the core portion have a distribution of a particle size having a D50 of 3.5 ?m or less.Type: ApplicationFiled: September 6, 2019Publication date: May 7, 2020Inventors: Il Jin PARK, Joong Won PARK, Se Hyung LEE, Soon Kwang KWON