Patents by Inventor Soon Lim

Soon Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11985350
    Abstract: An encoder capable of properly handling an image to be encoded or decoded includes processing circuitry and memory connected to the processing circuitry. Using the memory, the processing circuitry: obtains parameters including at least one of (i) one or more parameters related to a first process for correcting distortion in an image captured with a wide angle lens and (ii) one or more parameters related to a second process for stitching a plurality of images; generates an encoded image by encoding a current image to be processed that is based on the image or the plurality of images; and writes the parameters into a bitstream including the encoded image.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: May 14, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Chong Soon Lim, Han Boon Teo, Takahiro Nishi, Tadamasa Toma, Ru Ling Liao, Sughosh Pavan Shashidhar, Hai Wei Sun
  • Patent number: 11985349
    Abstract: An encoder capable of properly handling an image to be encoded or decoded includes processing circuitry and memory connected to the processing circuitry. Using the memory, the processing circuitry: obtains parameters including at least one of (i) one or more parameters related to a first process for correcting distortion in an image captured with a wide angle lens and (ii) one or more parameters related to a second process for stitching a plurality of images; generates an encoded image by encoding a current image to be processed that is based on the image or the plurality of images; and writes the parameters into a bitstream including the encoded image.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: May 14, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Chong Soon Lim, Han Boon Teo, Takahiro Nishi, Tadamasa Toma, Ru Ling Liao, Sughosh Pavan Shashidhar, Hai Wei Sun
  • Patent number: 11984356
    Abstract: A semiconductor device with liner-free contact structures and a method of fabricating the same are disclosed. The method includes forming first and second source/drain (S/D) regions on first and second fin structures, forming a first dielectric layer between the first and second S/D regions, forming first and second gate-all-around (GAA) structures on the first and second fin structures, forming a second dielectric layer on the first and second GAA structures and the first dielectric layer, forming a tapered trench opening in the second dielectric layer and on the first and second GAA structures and the first dielectric layer, selectively forming a seed layer on top surfaces of the first and second GAA structures and the first dielectric layer that are exposed in the tapered trench opening, and selectively depositing a conductive layer on the seed layer to fill the tapered trench opening.
    Type: Grant
    Filed: November 4, 2021
    Date of Patent: May 14, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peng-Soon Lim, Chung-Liang Cheng, Huang-Lin Chao
  • Patent number: 11978394
    Abstract: A display device includes: a first partial emission driver configured to provide first emission control signals to a first partial panel area of the display panel, and a second partial emission driver configured to provide second emission control signals to a second partial panel area of the display panel; and a power management block configured to: provide a first voltage and a second voltage to the emission driver, in response to the first partial emission driver generating the first emission control signals; and provide a third voltage and a fourth voltage to the emission driver in response to the second partial emission driver generating the second emission control signals; and an emission control block configured to receive the first voltage and the second voltage from the power management block and to provide a first clock signal and a second clock signal to the emission driver.
    Type: Grant
    Filed: April 30, 2021
    Date of Patent: May 7, 2024
    Assignee: Samsung Display Co., Ltd.
    Inventors: Taehoon Kim, Soon-Dong Kim, Jaekeun Lim, Joon-Chul Goh, Bonghyun You
  • Publication number: 20240146947
    Abstract: An encoder includes circuitry and memory. The circuitry determines whether a first virtual pipeline decoding unit (VPDU) is split into smaller blocks and whether a second VPDU is split into smaller blocks. In response to a determination the first VPDU is not split into smaller blocks and a determination the second VPDU is split into smaller blocks, a block of chroma samples is predicted without using luma samples. In response to a determination the first VPDU is split into smaller blocks and a determination the second VPDU is split into smaller blocks, the block of chroma samples is predicted using luma samples. In response to a determination the first VPDU is not split into smaller blocks and a determination the second VPDU is not split into smaller block, the block of chroma samples is predicted using luma samples. The block is encoded using the predicted chroma samples.
    Type: Application
    Filed: January 3, 2024
    Publication date: May 2, 2024
    Inventors: Che-Wei KUO, Jing Ya LI, Chong Soon LIM, Han Boon TEO, Hai Wei SUN, Rohith MARS, Tadamasa TOMA, Takahiro NISHI, Kiyofumi ABE, Yusuke KATO
  • Publication number: 20240130934
    Abstract: Disclosed is a bulk block for manufacturing a prosthesis having high aesthetics and processability required for one-day dental prosthetic materials, which is a dental composite bulk block comprising a glass ceramic matrix and a polymer, wherein the glass ceramic matrix consists of an amorphous glass matrix and a crystalline phase dispersed in the glass matrix, the crystalline phase comprises as a main crystalline phase at least one selected from a leucite crystalline phase and a lithium disilicate crystalline phase, and has an average particle diameter of 0.01-1.0 ?m, and the polymer is included in an amount of 20-40 wt % with respect to the weight of the total bulk block. The bulk block has the advantages of improved mechanical properties, being capable of preventing microleakage, exhibiting excellent aesthetics, and enabling machining.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 25, 2024
    Applicant: HASS CO., LTD.
    Inventors: Hyung Bong LIM, Sung Min KIM, Sung Ho HA, Moon Chang KIM, Hwan Soon KOH
  • Publication number: 20240129523
    Abstract: An encoder includes circuitry and memory. Using the memory, the circuitry, in operation, selects an encoding mode from among candidates including a decoder-side motion vector refinement (DMVR) encoding mode and a partition encoding mode. When the DMVR encoding mode is selected, the circuitry: obtains a first motion vector for a first image block; derives a second motion vector from the first motion vector using motion search; and generates a prediction image for the first image block using the second motion vector. When the partition encoding mode is selected, the circuitry: determines a plurality of partitions in a second image block; obtains a third motion vector for each partition; and generates a prediction image for the second image block using the third motion vector, without deriving a fourth motion vector from the third motion vector using motion search.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 18, 2024
    Inventors: Kiyofumi ABE, Takahiro NISHI, Tadamasa TOMA, Ryuichi KANOH, Chong Soon LIM, Ru Ling LIAO, Hai Wei SUN, Sughosh Pavan SHASHIDHAR, Han Boon TEO, Jing Ya LI
  • Patent number: 11961564
    Abstract: To program in a nonvolatile memory device including a cell region including first metal pads and a peripheral region including second metal pads and vertically connected to the cell region by the first metal pads and the second metal pads, a memory block is provided with a plurality of sub blocks disposed in a vertical direction where the memory block includes a plurality of cell strings each including a plurality of memory cells connected in series and disposed in the vertical direction. A plurality of intermediate switching transistors are disposed in a boundary portion between two adjacent sub blocks in the vertical direction. Each of the plurality of intermediate switching transistors is selectively activated based on a program address during a program operation. The selectively activating each of the plurality of intermediate switching transistors includes selectively turning on one or more intermediate switching transistors in a selected cell string based on the program address.
    Type: Grant
    Filed: October 18, 2021
    Date of Patent: April 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chang-Yeon Yu, Kui-Han Ko, Il-Han Park, June-Hong Park, Joo-Yong Park, Joon-Young Park, Bong-Soon Lim
  • Patent number: 11961825
    Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more stacks of microelectronic devices are located on the substrate, and microelectronic devices of the stacks are connected to vertical conductive paths external to the stacks and extending to the substrate and to lateral conductive paths extending between the stacks. Methods of fabrication are also disclosed.
    Type: Grant
    Filed: June 7, 2022
    Date of Patent: April 16, 2024
    Assignee: Micron Technology, Inc.
    Inventors: Aparna U. Limaye, Dong Soon Lim, Randon K. Richards, Owen R. Fay
  • Patent number: 11962804
    Abstract: An encoder capable of properly handling an image to be encoded or decoded includes processing circuitry and memory connected to the processing circuitry. Using the memory, the processing circuitry: obtains parameters including at least one of (i) one or more parameters related to a first process for correcting distortion in an image captured with a wide angle lens and (ii) one or more parameters related to a second process for stitching a plurality of images; generates an encoded image by encoding a current image to be processed that is based on the image or the plurality of images; and writes the parameters into a bitstream including the encoded image.
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: April 16, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Chong Soon Lim, Han Boon Teo, Takahiro Nishi, Tadamasa Toma, Ru Ling Liao, Sughosh Pavan Shashidhar, Hai Wei Sun
  • Publication number: 20240121384
    Abstract: An encoder includes circuitry and memory connected to the circuitry. The circuitry: derives an absolute value of a sum of horizontal gradient values; derives, as a first parameter, the total sum of the absolute values of horizontal gradient values; derives, as a second parameter, the total sum of the absolute values of vertical gradient values; derives a horizontal-related pixel difference value; derives, as a third parameter, the total sum of the absolute values of horizontal-related pixel difference values; derives a vertical-related pixel difference value; derives, as a fourth parameter, the total sum of the absolute values of vertical-related pixel difference values; and generates a prediction image using the first to fourth parameters.
    Type: Application
    Filed: December 14, 2023
    Publication date: April 11, 2024
    Inventors: Jing Ya LI, Ru Ling Liao, Chong Soon Lim, Han Boon Teo, Hai Wei Sun, Che Wei Kuo, Kiyofumi Abe, Takahiro Nishi, Tadamasa Toma
  • Publication number: 20240121429
    Abstract: An image coding method includes: deriving a candidate for a motion vector of a current block from a co-located motion vector; adding the candidate to a list; selecting the motion vector of the current block from the list; and coding the current block, wherein the deriving includes: deriving the candidate by a first derivation scheme in the case of determining that each of a current reference picture and a co-located reference picture is a long-term reference picture; and deriving the candidate by a second derivation scheme in the case of determining that each of the current reference picture and the co-located reference picture is a short-term reference picture.
    Type: Application
    Filed: December 19, 2023
    Publication date: April 11, 2024
    Inventors: Viktor WAHADANIAH, Chong Soon LIM, Sue Mon Thet NAING, Hai Wei SUN, Takahiro NISHI, Hisao SASAI, Youji SHIBAHARA, Kyoko TANIKAWA, Toshiyasu SUGIO, Kengo TERADA, Toru MATSUNOBU
  • Patent number: 11956440
    Abstract: An image coding method includes: writing, into a sequence parameter set, buffer description defining information for defining a plurality of buffer descriptions; writing, into the sequence parameter set, reference list description defining information for defining a plurality of reference list descriptions corresponding to the buffer descriptions; and writing, into a first header of each processing unit which is included in a coded bitstream, buffer description selecting information for specifying a selected buffer description.
    Type: Grant
    Filed: November 15, 2022
    Date of Patent: April 9, 2024
    Assignee: SUN PATENT TRUST
    Inventors: Viktor Wahadaniah, Chong Soon Lim, Sue Mon Thet Naing, Hai Wei Sun, Takahiro Nishi, Hisao Sasai, Youji Shibahara, Toshiyasu Sugio, Kyoko Tanikawa, Toru Matsunobu, Kengo Terada
  • Patent number: 11956467
    Abstract: An encoder, when sub-block encoding is to be performed, determines a plurality of sub-blocks in a first image block, the plurality of sub-blocks including a first sub-block, determines a first motion vector for the first sub-block by referring to a first candidate list, performs first inter prediction processing on the first sub-block using the first motion vector, and encodes the first image block using a result of the first inter prediction processing. When partition encoding is to be performed, the encoder, in operation, determines a plurality of partitions in a second image block, the plurality of partitions including a first partition, determines a second motion vector for the first partition by referring to a second candidate list, performs second inter prediction processing on the first partition using the second motion vector, and encodes the second image block using a result of the second inter prediction processing.
    Type: Grant
    Filed: September 8, 2021
    Date of Patent: April 9, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA
    Inventors: Kiyofumi Abe, Takahiro Nishi, Tadamasa Toma, Ryuichi Kanoh, Chong Soon Lim, Ru Ling Liao, Hai Wei Sun, Sughosh Pavan Shashidhar, Han Boon Teo, Jing Ya Li
  • Publication number: 20240114134
    Abstract: An encoder includes circuitry and a memory coupled to the circuitry. The circuitry, in operation, determines whether or not a ternary split process of splitting a block into three sub blocks in a first direction parallel to a first longer side of the block is allowed by comparing a size of a second shorter side of the block to a minimum threshold value. The circuitry, responsive to the ternary split process being allowed, writes, into a bitstream, a split direction parameter indicative of a splitting direction. The circuitry, in operation, splits the block into a plurality of sub blocks in a direction indicated by the split direction parameter; and encodes the plurality of sub blocks. The minimum threshold value corresponds to a minimum size supported in a transform process.
    Type: Application
    Filed: December 5, 2023
    Publication date: April 4, 2024
    Inventors: Sughosh Pavan SHASHIDHAR, Hai Wei SUN, Chong Soon LIM, Ru Ling LIAO, Han Boon TEO, Jing Ya LI, Takahiro NISHI, Kiyofumi ABE, Ryuichi KANOH, Tadamasa TOMA
  • Publication number: 20240114169
    Abstract: An encoder determines, based on a width and a height of a block, whether or not to disable a prediction mode in which the block is split along a partitioning line defined by a distance and an angle and then prediction is performed; and encodes the block with the prediction mode disabled or not disabled according to a result of the determination on whether or not to disable the prediction mode. Here, the distance is the shortest distance between the center of the block and the partitioning line, and the angle is an angle representing a direction from the center of the block toward the partitioning line in the shortest distance. The encoder determines to disable the prediction mode when (i) a width-to-height ratio is at least 8 or (ii) a height-to-width ratio is at least 8.
    Type: Application
    Filed: December 1, 2023
    Publication date: April 4, 2024
    Inventors: Jing Ya LI, Che Wei KUO, Chong Soon LIM, Chu Tong WANG, Han Boon TEO, Hai Wei SUN, Kiyofumi ABE, Takahiro NISHI, Tadamasa TOMA, Yusuke KATO
  • Publication number: 20240114160
    Abstract: An image decoder includes circuitry and a memory, wherein the circuitry, in operation, calculates first values of a first partition in a current block, using a first motion vector for the first partition; calculates second values of a second partition in the current block, using a second motion vector for the second partition; calculates third values of a set of pixels between the first partition and the second partition, using the first motion vector; calculates fourth values of the set of pixels, using the second motion vector; and weights the third values and the fourth values. A number of pixels in a row in the set of pixels is two or more, and two or more weights applied to the third values increase along the row.
    Type: Application
    Filed: December 7, 2023
    Publication date: April 4, 2024
    Inventors: Kiyofumi ABE, Takahiro NISHI, Tadamasa TOMA, Ryuichi KANOH, Chong Soon LIM, Ru Ling LIAO, Hai Wei SUN, Sughosh Pavan SHASHIDHAR, Han Boon TEO, Jing Ya LI
  • Publication number: 20240114129
    Abstract: An encoder includes circuitry and memory coupled to the circuitry. The circuitry, in operation: determines whether a size of a current block, which is a unit for which a vector candidate list including vector candidates is generated, is less than or equal to a threshold; when the size of the current block is less than or equal to the threshold, generates the vector candidate list by registering a history-based motion vector predictor (HMVP) vector candidate in the vector candidate list from an HMVP table without performing a first pruning process; when the size of the current block is greater than the threshold, generates the vector candidate list by performing the first pruning process and registering the HMVP vector candidate in the vector candidate list from the HMVP table; and encodes the current block using the vector candidate list.
    Type: Application
    Filed: December 5, 2023
    Publication date: April 4, 2024
    Inventors: Jing Ya LI, Chong Soon Lim, Han Boon Teo, Che Wei Kuo, Hai Wei Sun, Chu Tong Wang, Kiyofumi Abe, Takahiro Nishi, Tadamasa Toma, Yusuke Kato
  • Publication number: 20240114136
    Abstract: An image encoder/decoder includes circuitry and a memory coupled to the circuitry. When a geometry of a block of a picture satisfies a first condition, the circuitry splits the block of the picture into sub blocks having a first set of geometries. When the geometry of the block does not satisfy the first condition, the circuitry splits the block of the picture into sub blocks having a second set of geometries, the second set of geometries being different from the first set of geometries. The circuitry encodes/decodes the sub blocks of the block.
    Type: Application
    Filed: December 6, 2023
    Publication date: April 4, 2024
    Inventors: Chong Soon LIM, Hai Wei SUN, Sughosh Pavan SHASHIDHAR, Han Boon TEO, Ru Ling LIAO, Takahiro NISHI, Tadamasa TOMA
  • Patent number: 11948921
    Abstract: Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate and the components are connected with conductive material in preformed holes in dielectric material in the bond lines aligned with TSVs of the devices and the exposed conductors of the substrate. Methods of fabrication are also disclosed.
    Type: Grant
    Filed: September 15, 2022
    Date of Patent: April 2, 2024
    Inventors: Randon K. Richards, Aparna U. Limaye, Owen R. Fay, Dong Soon Lim