Abstract: A BGA-type capacitor structure including a conventional chip capacitor mounted on the upper surface of an inexpensive substrate, and having solder balls mounted on a lower surface of the substrate. Lands that are required to mount the chip capacitor are formed on the substrate, which is offset from the surface of a PCB by the solder balls. The substrate can be a thin sheet of polyimide tape that is etched or perforated to provide holes through which the solder balls contact the lands used to mount the chip capacitor. An assembly incorporating the BGA capacitor structure includes a PCB having an array of metal vias extending between opposing upper and lower surfaces, a BGA IC mounted on the upper surface and soldered to first ends of the metal vias. The capacitor structures are soldered to contact pads formed on the lower surface of the PCB.