Abstract: Provided is a semiconductor package. More particularly, the present invention relates to a clip, a lead frame, and a substrate used in a semiconductor package having engraved patterns formed on surfaces thereof so as to increase an adhesive force and a corrosion resistant performance, thereby improving reliability of the semiconductor package, and the semiconductor package including the same.

Abstract: Provided is a semiconductor package using a conductive metal structure, and more particularly, to a semiconductor package using a conductive metal structure formed in a clip or a column, through which a semiconductor chip and a lead of a lead frame are electrically connected to each other and an area where the semiconductor chip and the metal structure are adhered may be effectively improved so that productivity may increase and durability and electrical connection properties may be improved. The semiconductor package according to the present invention includes: a semiconductor chip; an aluminum pad formed on an upper part of the semiconductor chip; and a conductive metal structure adhered to the aluminum pad by a solder-based second adhesive layer, wherein the second adhesive layer includes intermetallic compounds (IMC) distributed to a lower fixed part thereof near the aluminum pad.

Abstract: Provided is a press-fit pin.

Abstract: Provided is a press-fit pin.

Abstract: Provided is a semiconductor package. More particularly, the present invention relates to a clip, a lead frame, and a substrate used in a semiconductor package having engraved patterns formed on surfaces thereof so as to increase an adhesive force and a corrosion resistant performance, thereby improving reliability of the semiconductor package, and the semiconductor package including the same.

Abstract: A press-fit pin increases contact area with the contact hole to provide appropriate contact pressure, reduce contact resistance, and increase heat transfer efficiency. The press-fit pin is of a semiconductor package including an end portion and a press unit extending from the end portion and is divided into a first press-fitting piece and a second press-fitting piece, the first press-fitting piece forming a convex portion in a first direction perpendicular to the direction of the press-fit pin and bending to a second direction perpendicular to the direction of the press-fit pin and forming 30-110 degrees with the first direction and the second press-fitting piece forming a convex portion in a third direction perpendicular to the direction of the press-fit pin and being 180 degrees with the first direction and bending to a fourth direction perpendicular to the direction of the press-fit pin and forming 250-330 degrees with the first direction.

Abstract: A press-fit pin increases contact area with the contact hole to provide appropriate contact pressure, reduce contact resistance, and increase heat transfer efficiency. The press-fit pin is of a semiconductor package including an end portion and a press unit extending from the end portion and is divided into a first press-fitting piece and a second press-fitting piece, the first press-fitting piece forming a convex portion in a first direction perpendicular to the direction of the press-fit pin and bending to a second direction perpendicular to the direction of the press-fit pin and forming 30-110 degrees with the first direction and the second press-fitting piece forming a convex portion in a third direction perpendicular to the direction of the press-fit pin and being 180 degrees with the first direction and bending to a fourth direction perpendicular to the direction of the press-fit pin and forming 250-330 degrees with the first direction.

Abstract: The present disclosure relates to a semiconductor package having a double-sided heat dissipation structure, and more particularly, to a semiconductor package having a double-sided heat dissipation structure which rapidly transfers high heat generated in a semiconductor chip to substrates exposed to upper and lower surfaces of the package to have excellent dissipation effect.

Abstract: The present disclosure relates to a semiconductor package having a double-sided heat dissipation structure, and more particularly, to a semiconductor package having a double-sided heat dissipation structure which rapidly transfers high heat generated in a semiconductor chip to substrates exposed to upper and lower surfaces of the package to have excellent dissipation effect.