Patents by Inventor Soon Tatt Ow Yong

Soon Tatt Ow Yong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip package fixture
    Patent number: 8017434
    Abstract: Various methods and apparatus for holding a semiconductor chip package are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first plate adapted to hold a semiconductor chip package. The semiconductor chip package includes a carrier substrate and at least one semiconductor chip coupled to the carrier substrate. A second plate is formed with a first opening defining an interior peripheral surface adapted to compress an outer edge of the carrier substrate between the first plate and the second plate without engaging the at least one semiconductor chip.
    Type: Grant
    Filed: November 24, 2008
    Date of Patent: September 13, 2011
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Kevin W. Lim, Seah S. Too, Azlina N. Nayan, Kee Hean Keok, Soon Tatt Ow Yong
  • Semiconductor Chip Package Fixture
    Publication number: 20100129959
    Abstract: Various methods and apparatus for holding a semiconductor chip package are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first plate adapted to hold a semiconductor chip package. The semiconductor chip package includes a carrier substrate and at least one semiconductor chip coupled to the carrier substrate. A second plate is formed with a first opening defining an interior peripheral surface adapted to compress an outer edge of the carrier substrate between the first plate and the second plate without engaging the at least one semiconductor chip.
    Type: Application
    Filed: November 24, 2008
    Publication date: May 27, 2010
    Inventors: Kevin W. Lim, Seah S. Too, Azlina N. Nayan, Kee Hean Keok, Soon Tatt Ow Yong
  • Double-sided waffle pack
    Patent number: 7482697
    Abstract: Double-sided waffle packs and methods of using the same are provided. In one aspect, a waffle pack is provided that includes a body that has a first side and second side opposite the first side. The first side has a first cavity for enabling a semiconductor die to be seated therein when the body is in a first orientation. The second side has a second cavity for enabling a semiconductor die to be seated therein when the body is in a second orientation opposite the first orientation. The first cavity has a first footprint and the second cavity has a second footprint. The first and second footprints are substantially aligned vertically.
    Type: Grant
    Filed: August 2, 2006
    Date of Patent: January 27, 2009
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Soon Tatt Ow Yong, Hsiang Wan Liau, Yeow Guan Teh
  • Double-Sided Waffle Pack
    Publication number: 20080029904
    Abstract: Double-sided waffle packs and methods of using the same are provided. In one aspect, a waffle pack is provided that includes a body that has a first side and second side opposite the first side. The first side has a first cavity for enabling a semiconductor die to be seated therein when the body is in a first orientation. The second side has a second cavity for enabling a semiconductor die to be seated therein when the body is in a second orientation opposite the first orientation. The first cavity has a first footprint and the second cavity has a second footprint. The first and second footprints are substantially aligned vertically.
    Type: Application
    Filed: August 2, 2006
    Publication date: February 7, 2008
    Inventors: Soon Tatt Ow Yong, Hsiang Wan Liau, Yeow Guan Teh