Patents by Inventor Soon Wee Ho

Soon Wee Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package and method of forming the same
    Patent number: 11569146
    Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a semiconductor chip, a first mold compound layer at least partially covering the semiconductor chip, and a redistribution layer over the first mold compound layer, the redistribution layer including one or more electrically conductive lines in electrical connection with the semiconductor chip. The semiconductor package may additionally include a second mold compound layer over the redistribution layer, and an antenna array over the second mold compound layer, the antenna array configured to be coupled to the one or more electrically conductive lines.
    Type: Grant
    Filed: June 8, 2017
    Date of Patent: January 31, 2023
    Assignee: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
    Inventors: Ka Fai Chang, Yong Han, David Soon Wee Ho, Ying Ying Lim
  • SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
    Publication number: 20200185299
    Abstract: Various embodiments may provide a semiconductor package. The semiconductor package may include a semiconductor chip, a first mold compound layer at least partially covering the semiconductor chip, and a redistribution layer over the first mold compound layer, the redistribution layer including one or more electrically conductive lines in electrical connection with the semiconductor chip. The semiconductor package may additionally include a second mold compound layer over the redistribution layer, and an antenna array over the second mold compound layer, the antenna array configured to be coupled to the one or more electrically conductive lines.
    Type: Application
    Filed: June 8, 2017
    Publication date: June 11, 2020
    Inventors: Ka Fai CHANG, Yong HAN, David Soon Wee HO, Ying Ying LIM
  • DIE PACKAGE AND A METHOD FOR MANUFACTURING THE DIE PACKAGE
    Publication number: 20110316117
    Abstract: A die package and a method for manufacturing the die package are provided.
    Type: Application
    Filed: August 12, 2008
    Publication date: December 29, 2011
    Inventors: Vaidyanathan Kripesh, Navas Khan Oratti Kalandar, Srinivasa Rao Vempati, Aditya Kumar, Soon Wee Ho, Yak Long Samuel Lim, Gaurav Sharma, Wen Sheng Vincent Lee