Patents by Inventor SOON WON JEONG

SOON WON JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor light emitting device package
    Patent number: 10862015
    Abstract: A semiconductor light emitting device package includes a lead frame structure including a first lead frame and a second lead frame. A resin portion is adjacent to side surfaces of the first lead frame and the second lead frame. A semiconductor light-emitting device is mounted on the first lead frame and the second lead frame, in the form of a flip chip, by eutectic bonding. Each of the first lead frame and the second lead frame has a plurality of first grooves extended in a first direction.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: December 8, 2020
    Assignee: SAMSUNG ELECTRONICS., LTD.
    Inventors: In Hyung Lee, Sung Min Jang, Soon Won Jeong
  • SEMICONDUCTOR LIGHT EMITTING DEVICE PACKAGE
    Publication number: 20190280176
    Abstract: A semiconductor light emitting device package includes a lead frame structure including a first lead frame and a second lead frame. A resin portion is adjacent to side surfaces of the first lead frame and the second lead frame. A semiconductor light-emitting device is mounted on the first lead frame and the second lead frame, in the form of a flip chip, by eutectic bonding. Each of the first lead frame and the second lead frame has a plurality of first grooves extended in a first direction.
    Type: Application
    Filed: November 13, 2018
    Publication date: September 12, 2019
    Inventors: IN HYUNG LEE, SUNG MIN JANG, SOON WON JEONG