Patents by Inventor Soon Yeng Chan

Soon Yeng Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuits and methods using a non-gold corrosion inhibitor
    Patent number: 8998384
    Abstract: A circuit can include a die configured to electronically control particular elements and a flex circuit having copper leads coated with a non-gold corrosion inhibitor, the flex circuit being electrically connected to the die by the copper leads.
    Type: Grant
    Filed: March 31, 2011
    Date of Patent: April 7, 2015
    Assignees: Hewlett-Packard Development Company, L.P., 3M Innovative Properties Company
    Inventors: Lynn Walsh, Mark Walsh, Ronald L. Imken, Soon Yeng Chan, Alejandro Aldrin A. Narag, II
  • CIRCUITS AND METHODS USING A NON-GOLD CORROSION INHIBITOR
    Publication number: 20120249659
    Abstract: A circuit can include a die configured to electronically control particular elements and a flex circuit having copper leads coated with a non-gold corrosion inhibitor, the flex circuit being electrically connected to the die by the copper leads.
    Type: Application
    Filed: March 31, 2011
    Publication date: October 4, 2012
    Inventors: Lynn Walsh, Mark Walsh, Ronald L. Imken, Soon Yeng Chan, Alejandro Aldrin A. Narag, II