Patents by Inventor Soon-Yong Hur

Soon-Yong Hur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of fabricating a circuit board and semiconductor package.
    Patent number: 8061024
    Abstract: Provided are a circuit board, a semiconductor package including the circuit board, a method of fabricating the circuit board, and a method of fabricating the semiconductor package. The method of fabricating the circuit board includes: forming at least one pair of rows of first bonding pads arranged on a base substrate in a first direction, and a first central plating line formed between the rows of first bonding pads to commonly connect with the rows of first bonding pads; forming an electroplating layer on the first bonding pads; and exposing the base substrate by removing the first central plating line.
    Type: Grant
    Filed: May 23, 2008
    Date of Patent: November 22, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jong-Joo Lee, Soon-Yong Hur
  • Printed circuit board, semiconductor package, card apparatus, and system
    Patent number: 8026616
    Abstract: A printed circuit board providing high reliability using a packaging of high capacity semiconductor chip, a semiconductor package, and a card and a system using the semiconductor package.
    Type: Grant
    Filed: January 12, 2009
    Date of Patent: September 27, 2011
    Assignee: SAMSUNG Electronics Co., Ltd.
    Inventors: Soon-yong Hur, Mo-rae Kim, Hyeong-seob Kim
  • Memory module and connection interface between the memory module and circuit board
    Patent number: 7573724
    Abstract: A motherboard may have contact pads arranged along a peripheral region on one or both surfaces thereof. A memory module may have unit packages fixed to an upper plate and a lower plate of a module frame. The unit packages may be spaced apart from each other. The upper and the lower unit packages may have contact terminals facing each other. The contact terminals may be elastically bendable, and/or the unit packages may be mounted on the plates via elastic members. The peripheral region of the motherboard may be inserted into the memory module, so the contact terminals of the memory module may elastically contact with and be electrically coupled to the contact pads of the motherboard.
    Type: Grant
    Filed: June 7, 2005
    Date of Patent: August 11, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Soon-Yong Hur
  • PRINTED CIRCUIT BOARD, SEMICONDUCTOR PACKAGE, CARD APPARATUS, AND SYSTEM
    Publication number: 20090189271
    Abstract: A printed circuit board providing high reliability using a packaging of high capacity semiconductor chip, a semiconductor package, and a card and a system using the semiconductor package.
    Type: Application
    Filed: January 12, 2009
    Publication date: July 30, 2009
    Applicant: Samsung Electronics Co., Ltd
    Inventors: Soon-yong HUR, Mo-rae Kim, Hyeong-seob Kim
  • CIRCUIT BOARD, SEMICONDUCTOR PACKAGE HAVING THE BOARD, AND METHODS OF FABRICATING THE CIRCUIT BOARD AND THE SEMICONDUCTOR PACKAGE
    Publication number: 20080289177
    Abstract: Provided are a circuit board, a semiconductor package including the circuit board, a method of fabricating the circuit board, and a method of fabricating the semiconductor package. The method of fabricating the circuit board includes: forming at least one pair of rows of first bonding pads arranged on a base substrate in a first direction, and a first central plating line formed between the rows of first bonding pads to commonly connect with the rows of first bonding pads; forming an electroplating layer on the first bonding pads; and exposing the base substrate by removing the first central plating line.
    Type: Application
    Filed: May 23, 2008
    Publication date: November 27, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jong-Joo Lee, Soon-Yong Hur
  • Memory module and connection interface between the memory module and circuit board
    Publication number: 20060133058
    Abstract: A motherboard may have contact pads arranged along a peripheral region on one or both surfaces thereof. A memory module may have unit packages fixed to an upper plate and a lower plate of a module frame. The unit packages may be spaced apart from each other. The upper and the lower unit packages may have contact terminals facing each other. The contact terminals may be elastically bendable, and/or the unit packages may be mounted on the plates via elastic members. The peripheral region of the motherboard may be inserted into the memory module, so the contact terminals of the memory module may elastically contact with and be electrically coupled to the contact pads of the motherboard.
    Type: Application
    Filed: June 7, 2005
    Publication date: June 22, 2006
    Inventor: Soon-Yong Hur