Abstract: Disclosed are an optical member and a liquid crystal display. The optical member includes a host; a plurality of wavelength conversion particles in the host; and a plurality of electron receiving particles adjacent to the wavelength conversion particles, respectively.

Abstract: Disclosed is a display device. The display device includes a light source; a wavelength conversion member converting a wavelength of light output from the light source; a display panel to which the light is incident; a heat transfer part adjacent to the light source and the wavelength conversion member; and a heat dissipation part connected to the heat transfer part.

Abstract: Disclosed are an optical member, a display device having the same, and a method of fabricating the same. The optical member includes a receiving part having an empty space therein, a host in the receiving part, a plurality of wavelength conversion particles in the host, a sealing part in the receiving part, and a pre-treatment layer between the sealing part and an inner surface of the receiving part.

Abstract: Disclosed are a light conversion member, a display device including the same, and a method for fabricating the same. The light conversion member includes a host, a plurality of light conversion particles in the host, and a ferroelectric material in the host.

Abstract: Disclosed are an optical member, a display device having the same and a method of fabricating the same. The optical member includes a host; a plurality of light conversion particles dispersed in the host to convert a wavelength of light generated from a light source; and a protective layer surrounding the host and including plastic.

Abstract: Disclosed are an optical member and a display device including the same. The optical member includes a receiving member; a host in the receiving member; and a plurality of wavelength conversion particles distributed in the host. The receiving member includes a light incident part having a first refractive index; and a light exit part having a second refractive index different from the first refractive index. The optical member improves the optical characteristics by adjusting the refractive indexes of the light incident part and the light exit part.

Abstract: A multifunctional die attachment film used in a semiconductor packaging process includes a first die attachment film attached to a surface of a wafer having fine circuit patterns and solder bump patterns and having a first adhesive strength; and a second die attachment film attached on the first die attachment film and having a second adhesive strength with a wafer, a die chip, PCB and a flexible board, and the multifunctional die attachment film serves as a backgrinding tape in a backgrinding process, and after the backgrinding process is completed, the multifunctional die attachment film is not removed, but is used to attach a die chip to a connection member. And, the present invention utilizes the die attachment film as a backgrinding tape in the backgrinding process and concurrently a wafer protection means in a wafer dicing process, thereby preventing sawing burr, scratches or cracks.

Abstract: A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.

Abstract: A method for packaging a semiconductor is provided to allow uniform coating of a die attachment paste, shorten a B-staging time, and improve die pick-up characteristics and die attachment characteristics. This method includes preparing a die attachment paste with a viscosity of 1,500 to 100,000 cps; rotating a wafer and applying the die attachment paste to an upper surface of the wafer into a predetermined thickness; and B-staging the paste applied on the wafer. This method makes it possible to reduce costs by substituting for WBL (Wafer Backside Lamination) film, uniformly apply a die attachment paste to a wafer, freely control a thickness of applied die attachment paste by adjusting viscosity and dosage of discharged paste and a speed of a spin coater, and also shorten a process time by decreasing a B-staging time.

Abstract: The present invention relates to a semiconductor packaging method. The method comprises (S1) applying a die adhesive to an upper surface of a member through screen-printing; (S2) B-stage curing the member having the die adhesive; (S3) attaching a die on the B-stage cured die adhesive; (S4) wire-bonding the die to the member; and (S5) encapsulating the outside of the resultant, after the B-stage curing process of the step S2, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step S3 is performed such that the die adhesive maintains an adhesive strength of 10 kgf/cm2 or more at normal temperature after the die attaching.

Abstract: A dicing die attachment film includes a die attachment layer attached to one surface of a semiconductor wafer; a dicing film layer attached to a dicing die that is used for cutting the semi-conductor wafer into die units; and an intermediate layer laminated between the die attachment layer and the dicing film layer. The intermediate layer has a modulus of 100 to 3000 MPa, which is greater than a modulus of the die attachment layer and the dicing film layer.

Abstract: Provided are a bonding structure for a flat panel display and a method of forming the same, and a flat panel display, including the bonding structure. The bonding structure of a flat panel display device, which is formed between an upper substrate and a lower substrate to seal and bond the two substrates of the flat panel display device, and the bonding structure includes an outer separation wall and an inner separation wall of same heights being arranged along edges of the upper substrate and the lower substrate with a predetermined interval, and a sealant being applied between the outer separation wall and the inner separation wall.

Abstract: The present invention relates to a semiconductor packaging method. The method comprises (S1) applying a die adhesive to an upper surface of a member through screen-printing; (S2) B-stage curing the member having the die adhesive; (S3) attaching a die on the B-stage cured die adhesive; (S4) wire-bonding the die to the member; and (S5) encapsulating the outside of the resultant, after the B-stage curing process of the step S2, a degree of cure of the die adhesive shows a decrease in heat capacity by 80 to 100%, and the step S3 is performed such that the die adhesive maintains an adhesive strength of 10 kgf/cm2 or more at normal temperature after the die attaching.

Abstract: Provided are a bonding structure for a flat panel display and a method of forming the same, and a flat panel display, including the bonding structure. The bonding structure of a flat panel display device, which is formed between an upper substrate and a lower substrate to seal and bond the two substrates of the flat panel display device, and the bonding structure includes an outer separation wall and an inner separation wall of same heights being arranged along edges of the upper substrate and the lower substrate with a predetermined interval, and a sealant being applied between the outer separation wall and tn wall.

Abstract: A method of aligning an FLC using an ultraviolet irradiation is provided. In the method, the FLC includes a plurality of liquid crystal molecules each having a first group, and second through fourth groups arranged in a regular tetrahedron together with an axis of the first group centering on a chiral center, the method comprising: forming a photo-alignment layer on a substrate; and irradiating a polarized ultraviolet onto the photo-alignment layer formed on the substrate with an inclination angle, wherein an incident plane of the irradiated ultraviolet and the first group are not on the same plane but are perpendicular to each other, thereby bestowing a selectivity to one axis of the second through fourth groups. By aligning the CDR-FLC according to the present invention, and employing the aligned CDR-FLC in an LCD, the picture contrast ratio and the picture uniformity are enhanced.

Abstract: A method and apparatus for aligning a ferroelectric liquid crystal device and are provided. The method of aligning a ferroelectric liquid crystal device includes placing a liquid crystal device panel in a chamber maintained at a constant temperature; heating a lower substrate of the liquid crystal device to a temperature at which the liquid crystal changes into an isotropic phase; applying 1-100 kPa of pressure to the liquid crystal device; and cooling the lower substrate of the liquid crystal device slowly. A liquid crystal device aligned by the method is aligned uniformly across the entire panel.

Abstract: A reflecting type liquid crystal display device having a perpendicularly aligned structure and shorter response time and a projector using the same are provided. The reflecting type liquid crystal display device includes a first substrate having a reflective electrode, a second substrate having a transparent electrode, first and second alignment layers provided on the first substrate and the second substrate to be opposed to and face each other, a spacer interposed between the first alignment layer and the second alignment layer to form a predetermined cell gap therebetween, and vertically aligned liquid crystals injected into the cell gap, the cell gap being not greater than 1.0 ?m, the dielectric anisotropy of the liquid crystals being negative value, and the refractive index anisotropy of the liquid crystals being not less than 0.14.