Abstract: Provided is a method of manufacturing a circuit board including: preparing a first stack in which a first foil and a second foil are stacked, wherein a thickness of the second foil is greater than a thickness of the first foil, forming a first circuit pattern by etching the first foil, forming a second stack by arranging an insulating layer covering the first circuit pattern and a third foil attached to the insulating layer, reducing the thickness of the second foil and a thickness of the third foil through a half-etching process, removing the second foil of which the thickness has been reduced, and forming a second circuit pattern by etching the third foil.

Abstract: A method of manufacturing a multi-layer circuit board includes: forming a first circuit layer on a first surface of a first prepreg; stacking a second prepreg on a first surface of the first circuit layer; and forming at least one of a second or a third circuit layer on at least one of a first surface of the second prepreg and a second surface opposite of the first surface of the first prepreg, wherein, in the stacking of the first prepreg, the first prepreg and the second prepreg are semi-cured.

Abstract: Provided are a circuit board and a method of manufacturing the same which increase a peel strength between a prepreg and a copper plating layer. The method includes: providing a substrate including a first circuit pattern and a first prepreg; forming a plurality of holes on a top surface of the first prepreg; removing silica fillers contained in inner walls of the plurality of holes; and performing copper plating on the top surface of the first prepreg.

Abstract: A method of manufacturing a circuit board includes: providing a base substrate that comprises a first electrically conductive layer that has an inner circuit pattern formed on at least one surface of the base substrate; attaching a build-up material to the base substrate to insulate the first electrically conductive layer from outside; forming one or more holes at one time in the build-up material attached to the base substrate; forming a stack by curing the build-up material in which the one or more holes are formed; and forming a second electrically conductive layer that has an outer circuit pattern formed on at least one outer surface of the stack. The method may form the holes without drilling.