Patents by Inventor Soon Ho Lim

Soon Ho Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170096548
    Abstract: Provided is an aerogel-containing heat insulation composite obtained by providing a volatile material to the pores of the aerogel, blending the aerogel with a polymer resin, particularly a flexible polymer resin, to form a composite, and removing the volatile material. Thus, it is possible to prevent a decline of the porosity of the aerogel caused by infiltration and impregnation of the pores of the aerogel with the resin. As a result, the aerogel-containing heat insulation composite, particularly containing a high content of aerogel, may retain the heat insulation property of the aerogel as well as the flexibility of the plastic material.
    Type: Application
    Filed: September 28, 2016
    Publication date: April 6, 2017
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Seong Yun KIM, Hyun-Soo KIM, Hun-su LEE, Jaesang YU, Yong Chae JUNG, Jaewoo KIM, Cheol-Min YANG, Sang Jun YOUN, Soon Ho LIM
  • Patent number: 9142331
    Abstract: Disclosed is an elastomer-conductive filler composite with improved dielectric properties. The composite includes conductive fillers and an ionic liquid dispersing the conductive fillers. The ionic liquid is used as a dispersant to effectively enhance the dispersion of the conductive fillers, achieving a high dielectric constant and a low dielectric loss of the composite without deteriorating the physical properties of the conductive fillers. The use of the ionic liquid can reduce the number of processing steps and the presence of the conductive fillers at a low concentration in the composite can minimize deterioration of the physical properties of the elastomer. Further disclosed is a method for producing the composite.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: September 22, 2015
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Heesuk Kim, Kiwon Oh, Soon Ho Lim, Sang-Soo Lee, Tae Ann Kim, Min Park
  • Publication number: 20150073072
    Abstract: The present disclosure relates to an elastomer-conductive filler composite for a flexible electronic material having improved dielectric property and elastic modulus, and a method for preparing same. The elastomer-conductive filler composite according to the embodiments of the present disclosure solves the problem of the existing insulator-conductor composite that elastic modulus increases and adhesion property decreases with the increase in dielectric constant as the content of the conductive filler in elastomer increases. In particular, since the composite has a high dielectric constant in spite of a low content of the conductive filler and since the elastic modulus increased because of the conductive filler can be recovered by the plasticizer, the sensitivity of a sensor can be improved. Accordingly, it can be usefully used for flexible substrates and flexible touch panels or touchscreens, touchpads, etc. including them.
    Type: Application
    Filed: January 21, 2014
    Publication date: March 12, 2015
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Heesuk KIM, Hyeyoung JANG, Sang-Soo LEE, Soon Ho LIM, Min PARK
  • Publication number: 20130310495
    Abstract: Disclosed is an elastomer-conductive filler composite with improved dielectric properties. The composite includes conductive fillers and an ionic liquid dispersing the conductive fillers. The ionic liquid is used as a dispersant to effectively enhance the dispersion of the conductive fillers, achieving a high dielectric constant and a low dielectric loss of the composite without deteriorating the physical properties of the conductive fillers. The use of the ionic liquid can reduce the number of processing steps and the presence of the conductive fillers at a low concentration in the composite can minimize deterioration of the physical properties of the elastomer. Further disclosed is a method for producing the composite.
    Type: Application
    Filed: December 4, 2012
    Publication date: November 21, 2013
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Heesuk KIM, Kiwon OH, Soon Ho LIM, Sang-Soo LEE, Tae Ann KIM, Min PARK
  • Patent number: 8178201
    Abstract: An electroconductive particle that includes (a) a polymer microparticle, and (b) a graphene coating layer grafted on the polymer microparticle, which has improved long-term stability of the conductivity, surface conductivity, durability, and thermal resistance, and is applicable for producing an anisotropic conductive film used for packaging electronic devices.
    Type: Grant
    Filed: October 15, 2009
    Date of Patent: May 15, 2012
    Assignee: Korea Institute of Science and Technology
    Inventors: Sang-Soo Lee, Kyunghee Kim, Soon Ho Lim, Min Park, Jun Kyung Kim, Heesuk Kim, Hyunjung Lee
  • Publication number: 20100247892
    Abstract: The present invention discloses an electroconductive particle comprising (a) a polymer microparticle, and (b) a graphene coating layer grafted on the polymer microparticle, which has improved long-term stability of the conductivity, surface conductivity, durability, and thermal resistance, and is applicable for producing an anisotropic conductive film used for packaging electronic devices.
    Type: Application
    Filed: October 15, 2009
    Publication date: September 30, 2010
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNLOGY
    Inventors: Sang-Soo LEE, Kyunghee KIM, Soon Ho LIM, Min PARK, Jun Kyung KIM, Heesuk KIM, Hyunjung LEE
  • Patent number: 6770696
    Abstract: Disclosed is a method for preparing a clay-dispersed polymer nanocomposite. In this method, a polymer, which carries oxygen atoms within the repeating units of its backbone and is thermodynamically compatible with a binder resin, is used as a matrix resin. Useful is poly(&egr;-caprolactone) owing to its thermodynamic compatibility with poly(styrene-co-acrylonitrile)copolymers, poly(acrylonitrile-co-butadiene-co-styrene) copolymers, and poly(vinylchloride) resins. Poly(&egr;-caprolactone) resins aid the binder resins to penetrate into silicate layers so that the silicate of the organophilic clay was completely delaminated to silicate lamellas.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: August 3, 2004
    Assignee: Korea Institute of Science and Technology
    Inventors: Moon Bae Ko, Bum Suk Jung, Won Ho Jo, Seong Woo Kim, Moo Sung Lee, Jun Kyung Kim, Soon Ho Lim, Chul Rim Choe, Min Park