Abstract: A substrate processing apparatus with improved cleaning efficiency is provided. The substrate processing apparatus includes: a support member configured to support a substrate; a chemical solution supplier configured to supply chemical solution to the substrate; a sonic oscillator including an ultrasonic nozzle; a home port provided on one side of the support member and configured to accommodate the ultrasonic nozzle in a standby state; and a controller configured to control the support member, the chemical solution supplier, the sonic oscillator, and the home port, wherein the controller controls the ultrasonic nozzle to vibrate the chemical solution applied on the substrate during a cleaning period, and controls the ultrasonic nozzle to vibrate in the home port during a standby period to remove particles adhering to the ultrasonic nozzle.

Abstract: Proposed are a chemical liquid supply unit, a substrate processing apparatus having the same, and a chemical liquid supply method. More particularly, proposed is a technique for supplying chemical liquids of different flow rates, in which a chemical liquid is supplied at the same flow rate to each of a plurality of chemical liquid lines and the flow rate of the chemical liquid is adjusted through a flow control valve disposed on at least one chemical liquid line selected among the plurality of chemical liquid lines, so that the plurality of chemical liquid lines can supply chemical liquids at different flow rates.

Abstract: Disclosed is an apparatus for treating a substrate. The apparatus includes a substrate support unit that supports the substrate, a nozzle unit that dispenses a treatment liquid onto the substrate supported on the substrate support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle unit. The liquid supply unit includes a main supply line that is connected to the nozzle unit and that supplies the treatment liquid to the nozzle unit, wherein the treatment liquid is prepared by mixing a chemical with DIW at a first temperature and DIW at a second temperature higher than the first temperature, and temperature of the treatment liquid is adjusted by regulating a flow rate of the DIW at the first temperature and a flow rate of the DIW at the second temperature without a separate heater.

Abstract: Proposed are a chemical liquid supply unit, a substrate processing apparatus having the same, and a chemical liquid supply method. More particularly, proposed is a technique for supplying chemical liquids of different flow rates, in which a chemical liquid is supplied at the same flow rate to each of a plurality of chemical liquid lines and the flow rate of the chemical liquid is adjusted through a flow control valve disposed on at least one chemical liquid line selected among the plurality of chemical liquid lines, so that the plurality of chemical liquid lines can supply chemical liquids at different flow rates.

Abstract: The inventive concept relates to an apparatus for treating a substrate. The apparatus includes a substrate support unit that supports the substrate, a nozzle unit that dispenses a treatment liquid onto the substrate supported on the substrate support unit, and a liquid supply unit that supplies the treatment liquid to the nozzle unit. The liquid supply unit includes a main supply line that is connected to the nozzle unit and that supplies the treatment liquid to the nozzle unit, wherein the treatment liquid is prepared by mixing a chemical with DIW at a first temperature and DIW at a second temperature higher than the first temperature, and temperature of the treatment liquid is adjusted by regulating a flow rate of the DIW at the first temperature and a flow rate of the DIW at the second temperature.

Abstract: Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a housing defining a space for treating a substrate therein, a spin head supporting and rotating the substrate in the housing, a spray unit including a first nozzle member for spraying a first treating solution on the substrate placed on the spin head, and a controller controlling the spray unit. The controller sprays the first treating solution while moving the first nozzle member between edge and center regions of the substrate and above the substrate. The controller differently adjusts a first height at which the first treating solution is sprayed on the edge region of the substrate and a second height at which the first treating solution is sprayed on the center region of the substrate.