Patents by Inventor Soon Nyung Park

Soon Nyung Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Display device
    Patent number: 10078976
    Abstract: An exemplary embodiment of the present disclosure provides a display device including: a substrate including a display area and a non-display area; a COF package overlapped with the non-display area of the substrate; a printed circuit board (PCB) overlapped with the COF package; a plurality of pixels disposed on the display area of the substrate; a plurality of data lines connected to the plurality of pixels; a first crack sensing line disposed on the non-display area of the substrate; a second crack sensing line that extends to be parallel to the first crack sensing line on the non-display area of the substrate and is connected to the first data line of the plurality of data lines; a first dummy wire that is disposed on the COF package and is overlapped with the first crack sensing line and the second crack sensing line; a first anisotropic conductive film disposed between the substrate and the COF package; a first test pattern and a second test pattern disposed on the PCB; a third test pattern that is dispo
    Type: Grant
    Filed: January 4, 2017
    Date of Patent: September 18, 2018
    Assignee: Samsung Display Co., Ltd.
    Inventors: Wi Jin Nam, Hyeon Jin Kim, Soon Nyung Park
  • DISPLAY DEVICE
    Publication number: 20170270842
    Abstract: An exemplary embodiment of the present disclosure provides a display device including: a substrate including a display area and a non-display area; a COF package overlapped with the non-display area of the substrate; a printed circuit board (PCB) overlapped with the COF package; a plurality of pixels disposed on the display area of the substrate; a plurality of data lines connected to the plurality of pixels; a first crack sensing line disposed on the non-display area of the substrate; a second crack sensing line that extends to be parallel to the first crack sensing line on the non-display area of the substrate and is connected to the first data line of the plurality of data lines; a first dummy wire that is disposed on the COF package and is overlapped with the first crack sensing line and the second crack sensing line; a first anisotropic conductive film disposed between the substrate and the COF package; a first test pattern and a second test pattern disposed on the PCB; a third test pattern that is dispo
    Type: Application
    Filed: January 4, 2017
    Publication date: September 21, 2017
    Inventors: Wi Jin Nam, Hyeon Jin Kim, Soon Nyung Park