Patents by Inventor Soon-Won Jung
Soon-Won Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978870Abstract: The present invention relates to a method for manufacturing a secondary battery and a pre-degassing device for manufacturing a secondary battery.Type: GrantFiled: December 3, 2020Date of Patent: May 7, 2024Assignee: LG Energy Solution, Ltd.Inventors: Seong Won Choi, Su Taek Jung, Soon Kwan Kwon, Tae Jong Kim
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Publication number: 20240136674Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on a winding axis to define a core and an outer circumference. The first electrode includes a first active material portion coated with an active material layer and a first uncoated portion not coated with an active material layer along a winding direction. At least a part of the first uncoated portion is defined as an electrode tab by itself. The first uncoated portion includes a first portion adjacent to the core of the electrode assembly, a second portion adjacent to the outer circumference of the electrode assembly, and a third portion interposed between the first portion and the second portion. The first portion or the second portion has a smaller height than the third portion in the winding axis direction.Type: ApplicationFiled: January 19, 2022Publication date: April 25, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Jong-Sik PARK, Jae-Won LIM, Yu-Sung CHOE, Hak-Kyun KIM, Je-Jun LEE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Pil-Kyu PARK, Kwang-Su HWANGBO, Do-Gyun KIM, Geon-Woo MIN, Hae-Jin LIM, Min-Ki JO, Su-Ji CHOI, Bo-Hyun KANG, Jae-Woong KIM, Ji-Min JUNG, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI
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Publication number: 20240128517Abstract: Disclosed is an electrode assembly, a battery, and a battery pack and a vehicle including the same. In the electrode assembly, a first electrode, a second electrode, and a separator interposed therebetween are wound based on an axis to define a core and an outer circumference. The first electrode includes an uncoated portion at a long side end thereof and exposed out of the separator along a winding axis direction of the electrode assembly. A part of the uncoated portion is bent in a radial direction of the electrode assembly to form a bending surface region that includes overlapping layers of the uncoated portion, and in a partial region of the bending surface region, the number of stacked layers of the uncoated portion is 10 or more in the winding axis direction of the electrode assembly.Type: ApplicationFiled: January 19, 2022Publication date: April 18, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Hae-Jin LIM, Jin-Hak KONG, Soon-O LEE, Kyu-Hyun CHOI, Do-Gyun KIM, Su-Ji CHOI, Kwang-Su HWANGBO, Geon-Woo MIN, Min-Ki JO, Jae-Won LIM, Hak-Kyun KIM, Je-Jun LEE, Ji-Min JUNG, Jae-Woong KIM, Jong-Sik PARK, Yu-Sung CHOE, Byoung-Gu LEE, Duk-Hyun RYU, Kwan-Hee LEE, Jae-Eun LEE, Bo-Hyun KANG, Pil-Kyu PARK
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Publication number: 20240120616Abstract: A secondary battery includes an electrode assembly having a positive electrode provided with a positive electrode tab, a separator, and a negative electrode provided with a negative electrode tab, the positive electrode, the separator, and the negative electrode being wound, the electrode assembly having a core part at a center thereof; a can configured to receive the electrode assembly therein, the negative electrode tab being connected to the can; a cap assembly coupled to an opening of the can, the positive electrode tab being connected to the cap assembly; and a reinforcing member provided on an end of the separator exposed beyond the positive electrode or the negative electrode to prevent heat of the positive electrode tab or the negative electrode tab from being transferred to the separator.Type: ApplicationFiled: April 19, 2022Publication date: April 11, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Soon Kwan KWON, Su Taek JUNG, Seok Hoon JANG, Hyeok JEONG, Sang Ho BAE, Byeong Kyu LEE, Seong Won CHOI, Min Wook KIM, Yong Jun LEE
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Publication number: 20240114221Abstract: A camera module includes a housing, a reflective member positioned in the housing and changing a direction of light to a direction of an optical axis, a carrier carrying the reflective member and rotatable about a first axis with respect to the housing, and a first ball group disposed between the housing and the carrier, wherein the first ball group includes a main ball member providing the first axis of the carrier, and an auxiliary ball member disposed away from the first axis, and one or both of the housing and the carrier partially accommodates the auxiliary ball member, and includes an auxiliary guide groove extended in a circumferential direction of the first axis.Type: ApplicationFiled: December 15, 2023Publication date: April 4, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Hwan KWON, Nam Ki PARK, Young Bok YOON, Soon Seok KANG, Jae Won JUNG
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Publication number: 20240088520Abstract: Discussed is a method for manufacturing an electrode assembly and an electrode assembly manufactured therethrough, and the method includes a corona treatment process of performing corona discharge treatment on opposite edges of a separator in a direction perpendicular to a progress direction for manufacturing the electrode assembly, a lamination process of alternately laminating an electrode and the corona-treated separator, and a bonding process of pressing the electrode and the corona-treated separator, which are laminated, to bond the electrode to the corona-treated separator, wherein, in the corona treatment process, corona is locally discharged to the opposite edges of the separator to form a corona-treated section and a corona-untreated section on the opposite edges of the separator.Type: ApplicationFiled: October 14, 2020Publication date: March 14, 2024Applicant: LG ENERGY SOLUTION, LTD.Inventors: Soon Kwan KWON, Seong Won CHOI, Su Taek JUNG
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Patent number: 10629744Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.Type: GrantFiled: May 31, 2018Date of Patent: April 21, 2020Assignee: Electronics and Telecommunications Research InstituteInventors: Kyoung Ik Cho, Jae Bon Koo, Chan Woo Park, Bock Soon Na, Sang Seok Lee, Sang Chul Lim, Soon-Won Jung, Hye Yong Chu
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Publication number: 20180277684Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.Type: ApplicationFiled: May 31, 2018Publication date: September 27, 2018Applicant: Electronics and Telecommunications Research InstituteInventors: Kyoung Ik CHO, Jae Bon KOO, Chan Woo PARK, Bock Soon NA, Sang Seok LEE, Sang Chul LIM, Soon-Won JUNG, Hye Yong CHU
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Patent number: 10026844Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.Type: GrantFiled: March 17, 2017Date of Patent: July 17, 2018Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Kyoung Ik Cho, Jae Bon Koo, Chan Woo Park, Bock Soon Na, Sang Seok Lee, Sang Chul Lim, Soon-Won Jung, Hye Yong Chu
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Publication number: 20180012861Abstract: Provided is a method of manufacturing an electronic apparatus which includes preparing a substrate having a first Young's modulus, disposing a thin film having a second Young's modulus greater than the first Young's modulus on the substrate, disposing an electronic device on the thin film, and disposing a capping layer configured to cover the electronic device on the thin film.Type: ApplicationFiled: June 23, 2017Publication date: January 11, 2018Applicant: Electronics and Telecommunications Research InstituteInventors: Ji-Young OH, Joo Yeon KIM, Jae Bon KOO, Bock Soon NA, Nae-Man PARK, Chan Woo PARK, Sang Seok LEE, Soon Won JUNG, Chi-Sun HWANG, Keunsoo LEE
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Patent number: 9864251Abstract: Provided is a color changeable device which includes a first substrate and a second substrate that are spaced apart from each other, a first transparent electrode disposed on the first substrate, a second transparent electrode disposed on the second substrate, an electrochromic layer disposed between the first transparent electrode and the second transparent electrode, an organic layer disposed between the first transparent electrode and the electrochromic layer. The organic layer may include a hole injection layer or an electron injection layer. The organic layer may further include a hole transport layer or an electron transport layer.Type: GrantFiled: January 27, 2016Date of Patent: January 9, 2018Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Ji-Young Oh, Jae Bon Koo, Joo Yeon Kim, Bock Soon Na, Chan Woo Park, Sang Seok Lee, Soon-Won Jung, Seong-Mok Cho, Hye Yong Chu
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Patent number: 9865559Abstract: Provided is a method for manufacturing a stretchable wire, the method including removing a portion of a photoresist layer on a substrate to form a photoresist pattern comprising at least one pattern slit, applying a liquid-phase conductive material on the photoresist pattern to form a liquid-phase conductive structure in the pattern slit, forming a stretchable first insulating layer on the liquid-phase conductive structure, after removing the photoresist pattern, and separating the liquid-phase conductive structure and the first insulating layer from the substrate.Type: GrantFiled: July 26, 2016Date of Patent: January 9, 2018Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Chan Woo Park, Jae Bon Koo, Bock Soon Na, Rae-Man Park, Ji-Young Oh, Sang Seok Lee, Soon-Won Jung
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Patent number: 9842669Abstract: A stretchable wire including a stretchable solid-phase conductive structure; a stretchable insulation layer which surrounds the solid-phase conductive structure; and a liquid-phase conductive material layer disposed between the solid-phase conductive structure and the stretchable insulation layer, and in contact with the solid-phase conductive structure, and a method of fabricating the same.Type: GrantFiled: July 27, 2016Date of Patent: December 12, 2017Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Chan Woo Park, Jae Bon Koo, Bock Soon Na, Rae-Man Park, Ji-Young Oh, Sang Seok Lee, Soon-Won Jung
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Patent number: 9807886Abstract: Provided is an electronic circuit including a substrate having a flat device region and a curved interconnection region. A conduction line may extend along an uneven portion in the interconnection region and may be curved. The uneven portion and the conductive line may have a wavy shape. An external force applied to the electronic circuit may be absorbed by the uneven portion and the conductive line. The electronic device may not be affected by the external force. Therefore, functions of the electronic circuit may be maintained. A method of fabricating an electronic circuit according to the present invention may easily adjust areas and positions of the interconnection region and the device region.Type: GrantFiled: February 20, 2013Date of Patent: October 31, 2017Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Chan Woo Park, Jae Bon Koo, Sang Chul Lim, Ji-Young Oh, Soon-Won Jung
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Patent number: 9740073Abstract: Provided is a complex display device Including a first substrate and an opposed second substrate, a first electrode, an electrochromic layer, a common electrode, an emission part and a second electrode, laminated between the first substrate and the second substrate one by one, and an organic layer disposed between the first electrode and the electrochromic layer, or between the electrochromic layer and the common electrode. The organic layer of the complex display device may include at least one of a hole injection material, a hole transport material and a mixture thereof, or at least one of an electron injection material, an electron transport material or a mixture thereof.Type: GrantFiled: January 27, 2016Date of Patent: August 22, 2017Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Ji-Young Oh, Jae Bon Koo, Joo Yeon Kim, Bock Soon Na, Chan Woo Park, Sang Seok Lee, Soon-Won Jung, Hye Yong Chu
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Publication number: 20170186876Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.Type: ApplicationFiled: March 17, 2017Publication date: June 29, 2017Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Kyoung Ik CHO, Jae Bon KOO, Chan Woo PARK, Bock Soon NA, Sang Seok LEE, Sang Chul LIM, Soon-Won JUNG, Hye Yong CHU
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Publication number: 20170169918Abstract: Provided is a stretchable wire including: a stretchable solid-phase conductive structure; a stretchable insulation layer which surrounds the solid-phase conductive structure; and a liquid-phase conductive material layer disposed between the solid-phase conductive structure and the stretchable insulation layer, and in contact with the solid-phase conductive structure, and a method of fabricating the same.Type: ApplicationFiled: July 27, 2016Publication date: June 15, 2017Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Chan Woo PARK, Jae Bon KOO, Bock Soon NA, Rae-Man PARK, Ji-Young OH, Sang Seok LEE, Soon-Won JUNG
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Patent number: 9634120Abstract: Provided is a method for fabricating an electronic device, the method including: preparing a carrier substrate including an element region and a wiring region; forming a sacrificial layer on the carrier substrate; forming an electronic element on the sacrificial layer of the element region; forming a first elastic layer having a corrugated surface on the first elastic layer of the wiring region; forming a metal wirings electrically connecting the electronic element thereto, on the first elastic layer of the wiring region; forming a second elastic layer covering the metal wirings, on the first elastic layer; forming a high rigidity pattern filling in a recess of the second elastic layer above the electronic element so as to overlap the electronic element, and having a corrugated surface; forming a third elastic layer on the second elastic layer and the high rigidity pattern; and separating the carrier substrate.Type: GrantFiled: January 30, 2015Date of Patent: April 25, 2017Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Kyoung Ik Cho, Jae Bon Koo, Chan Woo Park, Bock Soon Na, Sang Seok Lee, Sang Chul Lim, Soon-Won Jung, Hye Yong Chu
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Publication number: 20170053894Abstract: Provided is a method for manufacturing a stretchable wire, the method including removing a portion of a photoresist layer on a substrate to form a photoresist pattern comprising at least one pattern slit, applying a liquid-phase conductive material on the photoresist pattern to form a liquid-phase conductive structure in the pattern slit, forming a stretchable first insulating layer on the liquid-phase conductive structure, after removing the photoresist pattern, and separating the liquid-phase conductive structure and the first insulating layer from the substrate.Type: ApplicationFiled: July 26, 2016Publication date: February 23, 2017Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Chan Woo PARK, Jae Bon KOO, Bock Soon NA, Rae-Man PARK, Ji-Young OH, Sang Seok LEE, Soon-Won JUNG
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Publication number: 20160266459Abstract: Provided is a complex display device Including a first substrate and an opposed second substrate, a first electrode, an electrochromic layer, a common electrode, an emission part and a second electrode, laminated between the first substrate and the second substrate one by one, and an organic layer disposed between the first electrode and the electrochromic layer, or between the electrochromic layer and the common electrode. The organic layer of the complex display device may include at least one of a hole injection material, a hole transport material and a mixture thereof, or at least one of an electron injection material, an electron transport material or a mixture thereof.Type: ApplicationFiled: January 27, 2016Publication date: September 15, 2016Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTEInventors: Ji-Young OH, Jae Bon KOO, Joo Yeon KIM, Bock Soon NA, Chan Woo PARK, Sang Seok LEE, Soon-Won JUNG, Hye Yong CHU