Patents by Inventor Soonwon LIM

Soonwon LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF REDUCING ADHESIVE STRENGTH OF ADHESION LAYER
    Publication number: 20260176496
    Abstract: The present invention provides: a method of reducing an adhesive strength of an adhesion layer, the method including applying an electric pulse to an article including a portion in which two or more members are bonded to each other via an adhesion layer containing a conductive filler, to thereby reduce an adhesive strength of the adhesion layer; and a method of reusing a member or a functional part in the member, the method including removing the member from the article by using the above-mentioned method.
    Type: Application
    Filed: January 12, 2023
    Publication date: June 25, 2026
    Applicants: WASEDA UNIVERSITY, ADEKA CORPORATION
    Inventors: Chiharu TOKORO, Manabu INUTSUKA, Soonwon LIM, Taketoshi KOITA, Masataka KONDO, Ryo OGAWA, Keisuke OTA