Patents by Inventor Sophia Huppmann
Sophia Huppmann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11961820Abstract: A method for producing a connection between component parts and a component made of component parts are disclosed. In an embodiment, a includes providing a first component part having a first exposed insulation layer and a second component part having a second exposed insulation layer, wherein each of the insulation layers has at least one opening, joining together the first and second component parts such that the opening of the first insulation layer and the opening of the second insulation layer overlap in top view, wherein an Au layer and a Sn layer are arranged one above the other in at least one of the openings and melting the Au layer and the Sn layer to form an AuSn alloy, wherein the AuSn alloy forms a through-via after cooling electrically conductively connecting the first component part to the second component part.Type: GrantFiled: February 5, 2019Date of Patent: April 16, 2024Assignee: OSRAM OLED GmbHInventors: Simeon Katz, Mathias Wendt, Sophia Huppmann, Marcus Zenger, Jens Mueller
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Patent number: 11695251Abstract: A laser diode chip has a laser facet, which includes a coating. The coating includes an inorganic layer and an organic layer. In one example, the coating has a number of inorganic layers, including a heat-conductive layer. For example, the inorganic layers may form a reflection-increasing or reflection-decreasing layer sequence.Type: GrantFiled: April 17, 2019Date of Patent: July 4, 2023Assignee: OSRAM OLED GMBHInventors: Alfred Lell, Sebastian Taeger, Sophia Huppmann
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Patent number: 11694977Abstract: In an embodiment a method includes providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias; providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias and joining the component parts such that the contact layers overlap each other thereby mechanically and electrically connecting the component partsType: GrantFiled: May 8, 2019Date of Patent: July 4, 2023Assignee: OSRAM Opto Semiconductors GmbHInventors: Simeon Katz, Sophia Huppmann, Michael Hoenle, Thorsten Wagner, Kurt Hingerl
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Patent number: 11557691Abstract: In an embodiment a method includes forming a semiconductor layer sequence on a growth substrate, applying a silicon oxide layer to a surface of the semiconductor layer sequence facing away from the growth substrate, applying a first metal layer to the silicon oxide layer, wherein the first metal layer includes gold, platinum, copper or silver, providing a silicon substrate and applying a second metal layer formed of the same material as the first metal layer to the silicon substrate, bonding the semiconductor layer sequence to the silicon substrate by direct bonding of the first metal layer to the second metal layer, wherein the first metal layer and the second metal layer are brought into contact at a temperature in a range of 150° C. to 400° C. so that they form a metal bonding layer and detaching the growth substrate from the semiconductor layer sequence.Type: GrantFiled: February 6, 2019Date of Patent: January 17, 2023Assignee: OSRAM OLED GmbHInventors: Simeon Katz, Sophia Huppmann
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Publication number: 20220376133Abstract: In an embodiment a method includes arranging a plurality of semiconductor chips on a carrier, arranging an auxiliary carrier on sides of the semiconductor chips facing away from the carrier, removing the carrier, separating the auxiliary carrier between the semiconductor chips to form auxiliary carrier-chip units, each of the auxiliary carrier-chip units has at least one semiconductor chip and an auxiliary carrier part adjoining the semiconductor chip, arranging each of the auxiliary carrier-chip units on a connecting carrier and removing the auxiliary carrier parts from each auxiliary carrier-chip unit.Type: ApplicationFiled: October 26, 2020Publication date: November 24, 2022Inventors: Ivar Tangring, Gudrun Lindberg, Viktor Geringer, Sophia Huppmann
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Patent number: 11289534Abstract: A component includes a substrate, a first semiconductor body having a first active layer, a second semiconductor body having a second active layer, and a first transition zone, wherein the first active layer is configured to generate electromagnetic radiation of a first peak wavelength and the second active layer is configured to generate electromagnetic radiation of a second peak wavelength, in the vertical direction, the first transition zone is arranged between the first and second semiconductor bodies and is directly adjacent to the first and second semiconductor bodies, the first transition zone includes a radiation-transmissive, at least for the radiation of the first peak wavelength partially transparent and electrically conductive material so that the first semiconductor body electrically conductively connects to the second semiconductor body via the first transition zone, and the first transition zone includes a structured surface or a first partially transparent and partially wavelength-selectivelyType: GrantFiled: May 26, 2017Date of Patent: March 29, 2022Assignee: OSRAM OLED GmbHInventors: Marika Hirmer, Sophia Huppmann, Simeon Katz
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Publication number: 20210066539Abstract: In an embodiment a method includes forming a semiconductor layer sequence on a growth substrate, applying a silicon oxide layer to a surface of the semiconductor layer sequence facing away from the growth substrate, applying a first metal layer to the silicon oxide layer, wherein the first metal layer includes gold, platinum, copper or silver, providing a silicon substrate and applying a second metal layer formed of the same material as the first metal layer to the silicon substrate, bonding the semiconductor layer sequence to the silicon substrate by direct bonding of the first metal layer to the second metal layer, wherein the first metal layer and the second metal layer are brought into contact at a temperature in a range of 150° C. to 400° C. so that they form a metal bonding layer and detaching the growth substrate from the semiconductor layer sequence.Type: ApplicationFiled: February 6, 2019Publication date: March 4, 2021Inventors: Simeon Katz, Sophia Huppmann
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Patent number: 10923400Abstract: The invention relates to a method for producing a plurality of components (100), wherein a carrier composite (10) is provided with a coherent base body (13) and a wafer composite (200) is provided with a coherent semiconductor body composite (20) and a substrate (9). The wafer composite is connected to the carrier composite to form a common composite. In a subsequent method step, a plurality of separation channels (60) are generated at least through the base body (13) to form a grid structure (6), which determines the dimensions of the components (100) to be produced. A passivation layer (61) is shaped in such a way that it covers the side surfaces of the separation channels (60). Finally, the common composite is separated, wherein the substrate (9) is removed from the semiconductor body composite (20) and the common composite is separated along the separation channels (60) to form a plurality of components (100).Type: GrantFiled: January 24, 2017Date of Patent: February 16, 2021Assignee: OSRAM OLED GMBHInventors: Sophia Huppmann, Dominik Scholz, Simeon Katz
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Publication number: 20210035934Abstract: In an embodiment a method includes providing the first component part with a partially exposed first insulating layer, a plurality of first through-vias and an exposed first contact layer structured in places and planarized in places, wherein the first through-vias are each laterally enclosed by the first insulating layer, and wherein the first contact layer partially covers the first insulating layer and completely covers the first through-vias; providing the second component part with a partially exposed second insulating layer, a plurality of second through-vias and an exposed second contact layer structured in places and planarized in places, wherein the second through-vias are each laterally enclosed by the second insulating layer, and wherein the second contact layer partially covers the second insulating layer and completely covers the second through-vias and joining the component parts such that the contact layers overlap each other thereby mechanically and electrically connecting the component partsType: ApplicationFiled: May 8, 2019Publication date: February 4, 2021Inventors: Simeon Katz, Sophia Huppmann, Michael Hoenle, Thorsten Wagner, Kurt Hingerl
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Publication number: 20200350359Abstract: A component includes a substrate, a first semiconductor body having a first active layer, a second semiconductor body having a second active layer, and a first transition zone, wherein the first active layer is configured to generate electromagnetic radiation of a first peak wavelength and the second active layer is configured to generate electromagnetic radiation of a second peak wavelength, in the vertical direction, the first transition zone is arranged between the first and second semiconductor bodies and is directly adjacent to the first and second semiconductor bodies, the first transition zone includes a radiation-transmissive, at least for the radiation of the first peak wavelength partially transparent and electrically conductive material so that the first semiconductor body electrically conductively connects to the second semiconductor body via the first transition zone, and the first transition zone includes a structured surface or a first partially transparent and partially wavelength-selectivelyType: ApplicationFiled: May 26, 2017Publication date: November 5, 2020Inventors: Marika Hirmer, Sophia Huppmann, Simeon Katz
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Patent number: 10804433Abstract: An optoelectronic device and a method are disclosed.Type: GrantFiled: January 24, 2019Date of Patent: October 13, 2020Assignee: OSRAM OLED GMBHInventors: Alexander F. Pfeuffer, Sophia Huppmann, Andrea Winnerl, Jens Müller
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Publication number: 20200294962Abstract: A method for producing a connection between component parts and a component made of component parts are disclosed. In an embodiment, a includes providing a first component part having a first exposed insulation layer and a second component part having a second exposed insulation layer, wherein each of the insulation layers has at least one opening, joining together the first and second component parts such that the opening of the first insulation layer and the opening of the second insulation layer overlap in top view, wherein an Au layer and a Sn layer are arranged one above the other in at least one of the openings and melting the Au layer and the Sn layer to form an AuSn alloy, wherein the AuSn alloy forms a through-via after cooling electrically conductively connecting the first component part to the second component part.Type: ApplicationFiled: February 5, 2019Publication date: September 17, 2020Inventors: Simeon Katz, Mathias Wendt, Sophia Huppmann, Marcus Zenger, Jens Mueller
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Publication number: 20200235012Abstract: The invention relates to a method for producing a plurality of components (100), wherein a carrier composite (10) is provided with a coherent base body (13) and a wafer composite (200) is provided with a coherent semiconductor body composite (20) and a substrate (9). The wafer composite is connected to the carrier composite to form a common composite. In a subsequent method step, a plurality of separation channels (60) are generated at least through the base body (13) to form a grid structure (6), which determines the dimensions of the components (100) to be produced. A passivation layer (61) is shaped in such a way that it covers the side surfaces of the separation channels (60). Finally, the common composite is separated, wherein the substrate (9) is removed from the semiconductor body composite (20) and the common composite is separated along the separation channels (60) to form a plurality of components (100).Type: ApplicationFiled: January 24, 2017Publication date: July 23, 2020Inventors: Sophia HUPPMANN, Dominik SCHOLZ, Simeon KATZ
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Patent number: 10686099Abstract: An optoelectronic device (50) comprising a semiconductor body (10a, 10b, 10c) having an optically active region (12), a carrier (60), and a pair of connection layers (30a, 30b, 30c) having a first connection layer (32) and a second connection layer (34), wherein: the semiconductor body is disposed on the carrier, the first connection layer is disposed between the semiconductor body and the carrier and is connected to the semiconductor body, the second connection layer is disposed between the first connection layer and the carrier, at least one layer selected from the first connection layer and the second connection layer contains a radiation-permeable and electrically conductive oxide, and the first connection layer and the second connection layer are directly connected to each other at least in regions in one or more bonding regions, so that the pair of connection layers is involved in the mechanical connection of the semiconductor body to the carrier. A production process is also specified.Type: GrantFiled: February 10, 2017Date of Patent: June 16, 2020Assignee: OSRAM OLED GMBHInventors: Sophia Huppmann, Simeon Katz, Marcus Zenger
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Patent number: 10475955Abstract: A method for producing a plurality of components and a component are disclosed. In an embodiment the method includes providing a carrier composite comprising a base body and a planar connecting surface, providing a wafer composite comprising a semiconductor body composite and a planar contact surface, connecting the wafer composite to the carrier composite thereby forming a joint composite so that the planar contact surface and the planar connecting surface are joined forming a joint boundary surface. The method further includes reducing inner mechanical stress in the joint composite so that a material of the carrier composite is removed in places, wherein the joint composite is thermally treated in order to form a permanent mechanically-stable connection between the wafer composite and the carrier composite, and wherein reducing inner stress is effected prior to the thermal treatment.Type: GrantFiled: November 30, 2016Date of Patent: November 12, 2019Assignee: OSRAM Opto Semiconductors GmbHInventors: Sophia Huppmann, Simeon Katz, Marcus Zenger, Dominik Scholz
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Publication number: 20190245323Abstract: A laser diode chip has a laser facet, which includes a coating. The coating includes an inorganic layer and an organic layer. In one example, the coating has a number of inorganic layers, including a heat-conductive layer. For example, the inorganic layers may form a reflection-increasing or reflection-decreasing layer sequence.Type: ApplicationFiled: April 17, 2019Publication date: August 8, 2019Inventors: Alfred Lell, Sebastian Taeger, Sophia Huppmann
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Publication number: 20190229240Abstract: An optoelectronic device and a method are disclosed.Type: ApplicationFiled: January 24, 2019Publication date: July 25, 2019Inventors: Alexander F. Pfeuffer, Sophia Huppmann, Andrea Winnerl, Jens Müller
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Publication number: 20190097088Abstract: An optoelectronic device (50) comprising a semiconductor body (10a, 10b, 10c) having an optically active region (12), a carrier (60), and a pair of connection layers (30a, 30b, 30c) having a first connection layer (32) and a second connection layer (34), wherein: the semiconductor body is disposed on the carrier, the first connection layer is disposed between the semiconductor body and the carrier and is connected to the semiconductor body, the second connection layer is disposed between the first connection layer and the carrier, at least one layer selected from the first connection layer and the second connection layer contains a radiation-permeable and electrically conductive oxide, and the first connection layer and the second connection layer are directly connected to each other at least in regions in one or more bonding regions, so that the pair of connection layers is involved in the mechanical connection of the semiconductor body to the carrier. A production process is also specified.Type: ApplicationFiled: February 10, 2017Publication date: March 28, 2019Inventors: Sophia HUPPMANN, Simeon KATZ, Marcus ZENGER
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Publication number: 20180358509Abstract: A method for producing a plurality of components and a component are disclosed. In an embodiment the method includes providing a carrier composite comprising a base body and a planar connecting surface, providing a wafer composite comprising a semiconductor body composite and a planar contact surface, connecting the wafer composite to the carrier composite thereby forming a joint composite so that the planar contact surface and the planar connecting surface are joined forming a joint boundary surface. The method further includes reducing inner mechanical stress in the joint composite so that a material of the carrier composite is removed in places, wherein the joint composite is thermally treated in order to form a permanent mechanically-stable connection between the wafer composite and the carrier composite, and wherein reducing inner stress is effected prior to the thermal treatment.Type: ApplicationFiled: November 30, 2016Publication date: December 13, 2018Inventors: Sophia Huppmann, Simeon Katz, Marcus Zenger, Dominik Scholz
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Publication number: 20160365699Abstract: A laser diode chip has a laser facet, which includes a coating. The coating includes an inorganic layer and an organic layer. In one example, the coating has a number of inorganic layers, including a heat-conductive layer. For example, the inorganic layers may form a reflection-increasing or reflection-decreasing layer sequence.Type: ApplicationFiled: February 16, 2015Publication date: December 15, 2016Inventors: Alfred Lell, Sebastian Taeger, Sophia Huppmann