Abstract: A reusable image forming medium, including a substrate; an imaging layer coated on or impregnated into the substrate, wherein an irradiation of the imaging layer produces an image; and a signature material coated on or impregnated into the substrate or the imaging layer, the signature material being detectable by a sensor.

Abstract: A reusable image forming medium, including a substrate; an imaging layer coated on or impregnated into the substrate, wherein an irradiation of the imaging layer produces an image; and a signature material coated on or impregnated into the substrate or the imaging layer, the signature material being detectable by a sensor.

Abstract: A reusable image forming medium, including a substrate; an imaging layer coated on or impregnated into the substrate, wherein an irradiation of the imaging layer produces an image; and a signature material coated on or impregnated into the substrate or the imaging layer, the signature material being detectable by a sensor.

Abstract: A reusable image forming medium, including a substrate; an imaging layer coated on or impregnated into the substrate, wherein an irradiation of the imaging layer produces an image; and a signature material coated on or impregnated into the substrate or the imaging layer, the signature material being detectable by a sensor.

Abstract: A reusable image forming medium, including a substrate; an imaging layer coated on or impregnated into the substrate, wherein an irradiation of the imaging layer produces an image; and a signature material coated on or impregnated into the substrate or the imaging layer, the signature material being detectable by a sensor.

Abstract: A dynamic reimageable document or electric paper can be formed from ordinary substrates such as paper, transparencies or fabric by printing of microencapsulated Gyricon beads onto one or more discrete surface areas of the substrate. The substrate can include both fixed print regions formed by conventional fixed ink processes and dynamic reimageable regions formed by the Gyricon beads. The Gyricon beads are preferably bichromal and of contrasting colors, such as black/white so as to be changeable to display two states by selective application of electromagnetic force to the beads. By providing bichromal beads in differing color combinations, such as red/white and black/white, a multi-colored document can be achieved in which various fields of the document, representing text, images or graphics, may be in differing colors. Moreover, operations to perform both imaging or erasure can act on the discrete reimageable regions so that the versatility of the electric paper can be enhanced.

Abstract: A dynamic reimageable document or electric paper can be formed from ordinary substrates such as paper, transparencies or fabric by printing of microencapsulated Gyricon beads onto one or more discrete surface areas of the substrate. The substrate can include both fixed print regions formed by conventional fixed ink processes and dynamic reimageable regions formed by the Gyricon beads. The Gyricon beads are preferably bichromal and of contrasting colors, such as black/white so as to be changeable to display two states by selective application of electromagnetic force to the beads. By providing bichromal beads in differing color combinations, such as red/white and black/white, a multi-colored document can be achieved in which various fields of the document, representing text, images or graphics, may be in differing colors. Moreover, operations to perform both imaging or erasure can act on the discrete reimageable regions so that the versatility of the electric paper can be enhanced.

Abstract: A printing device having a print carriage assembly that reduces a carriage excursion along a carriage scan axis and/or reduces a width of a printing flat zone along a media feed axis, is disclosed. The print carriage assembly has a frame that traverses across a media along a carriage scan axis. The media travels along a media feed axis that is substantially perpendicular to the carriage scan axis. A first print cartridge subassembly includes a first base secured to the frame and a plurality of first print elements secured to the first base. Each of the first print elements includes a first nozzle array for ejecting an ink composition. The plurality of first print elements are spaced apart along the carriage scan axis and are offset along the media feed axis. A second print cartridge subassembly includes a second base secured to the frame and a plurality of second print elements secured to the second base. Each of the second print elements have a second nozzle array for ejecting an ink composition.

Abstract: An ink status system for determining the status of a consumable supply of ink contained in an ink container. The ink status system includes a first conductor, disposed on a first wall of the ink container, being aligned with the first wall such that the consumable supply of ink contacts a decreasing portion of the first conductor during consumption thereof and an ink sensing circuit, coupled to the first conductor, generating a continuously variable ink level signal as a function of the decreasing portion of the first conductor being contacted by the consumable supply of ink during consumption thereof. The ink status system is used in a liquid ink printer to determine the amount of ink remaining in an ink tank or ink cartridge. A liquid ink printhead of the printer includes the necessary circuitry to generate a signal indicating the status of the ink which can include ink levels as well as ink types or colors.

Abstract: A method for electrical tailoring of thermal ink jet heater elements. The resistance of ink-jet heater elements formed of polysilicon is changed by applying energy through the resistor element of varying amounts at varying pulse widths. The application of pulsed current for up to 1 second total pulse width at voltages of up to 50 volts decreases the resistance by as much as thirty percent or more of the as fabricated values.

Abstract: A protection circuit prevents snapback events in MOS transistors associated with semiconductor or micromechanical structures, such as ink-jet ejectors. A bulk electrode associated with the MOS transistor is monitored for unusual high voltages which are consistent with an impending snapback event. The voltage on the bulk electrode is then used to turn on the control transistor which connects the gate of the MOS transistor to ground and thereby protects the device.

Abstract: A porous silicon Light Emitting Diodes (LEDs) device and method for fabricating LEDs with supporting circuits on a silicon chip or wafer for a Full Width Array in which a switch diode structure is used to form the porous silicon LED element and later drives the LED after the LED is fabricated. The LED is formed by defining an area in the switch diode for placing an LED element. Epi silicon is deposited in the defined area; and the epi silicon is electrochemical etched to produce porous silicon. This procedure creates column-like Si structures of nanometer dimension which can efficiently emit visible to infrared light at room temperature. Next, the porous silicon LED chip can be cut and butted without excessive damage. In this way, the chips bearing both LEDs and drive circuitry are made of silicon and can be cut and accurately butted by known techniques to form a low cost, high resolution Full Width LED array.

Abstract: A porous silicon Light Emitting Diodes (LEDs) device and method for fabricating LEDs with supporting circuits on a silicon chip or wafer for a Full Width Array in which a switch diode structure is used to form the porous silicon LED element and later drives the LED after the LED is fabricated. The LED is formed by defining an area in the switch diode for placing an LED element. Epi silicon is deposited in the defined area; and the epi silicon is electrochemical etched to produce porous silicon. This procedure creates column-like Si structures of nanometer dimension which can efficiently emit visible to infrared light at room temperature. Next, the porous silicon LED chip can be cut and butted without excessive damage. In this way, the chips bearing both LEDs and drive circuitry are made of silicon and can be cut and accurately butted by known techniques to form a low cost, high resolution Full Width LED array.