Abstract: The invention relates to a memory cell consisting of an isolated MOS transistor having a drain (8), a source (7) and a body region covered with an insulated gate (12), in which the body region is divided through its thickness into two separate regions (13, 14) of opposite conductivity types extending parallel to the plane of the gate, the body region closest to the gate having the opposite conductivity type to that of the drain/source.

Abstract: A memory cell formed of a semiconductor nanorod having its ends heavily doped to form source and drain regions and having its central portion including, between the source and drain regions, an N-type region surrounded on a majority of its periphery with a quasi-intrinsic P-type region, and wherein the P-type region itself is surrounded with an insulated gate.

Abstract: The invention relates to a memory cell consisting of an isolated MOS transistor having a drain (8), a source (7) and a body region covered with an insulated gate (12), in which the body region is divided through its thickness into two separate regions (13, 14) of opposite conductivity types extending parallel to the plane of the gate, the body region closest to the gate having the opposite conductivity type to that of the drain/source.

Abstract: A memory device is provided comprising a transistor having a floating body positioned between source and drain regions, the floating body being sandwiched between first and second insulated gates each comprising a gate electrode. A control circuit is arranged to program the state of said floating body to have an accumulation or depletion of majority carriers by applying one of first and second voltage levels between the first gate and at least one of the source and drain regions, and to retain the programmed state of said floating body by applying a third voltage level to the second gate. The voltages are switched over a time duration shorter than 100 ns.

Abstract: A memory element includes a MOS transistor having a drain, a source and a body region covered by an insulated gate, wherein the thickness of the body region is divided into two distinct regions separated by a portion of an insulating layer extending parallel to the plane of the gate.

Abstract: A memory device is provided comprising a transistor having a floating body positioned between source and drain regions, the floating body being sandwiched between first and second insulated gates each comprising a gate electrode. A control circuit is arranged to program the state of said floating body to have an accumulation or depletion of majority carriers by applying one of first and second voltage levels between the first gate and at least one of the source and drain regions, and to retain the programmed state of said floating body by applying a third voltage level to the second gate. The voltages are switched over a time duration shorter than 100 ns.