Patents by Inventor Sota TAKAHASHI

Sota TAKAHASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11762514
    Abstract: A capacitive sensor has a structure in which first transparent electrode portions and second transparent electrode portions formed from crystalline indium tin oxide (ITO) are provided on a base material by patterning. A bridge wiring portion formed from amorphous indium zinc oxide (IZO) is provided on each two adjacent first transparent electrode portions and a link continuous to them, with an insulating layer intervening between the bridge wiring portion and the two first transparent electrode portions and link. These two adjacent second transparent electrode portions are electrically connected together by the bridge wiring portion. The thickness of the second transparent electrode portion TE and the thickness of the bridge wiring portion TB satisfy the following expressions: 0.28×TE+83 nm?TB?0.69×TE+105 nm; and 30 nm?TE?50 nm.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: September 19, 2023
    Assignee: Alps Alpine Co., Ltd.
    Inventors: Manabu Yazawa, Ken Yamamura, Sota Takahashi
  • Publication number: 20220382413
    Abstract: A capacitive sensor has a structure in which first transparent electrode portions and second transparent electrode portions formed from crystalline indium tin oxide (ITO) are provided on a base material by patterning. A bridge wiring portion formed from amorphous indium zinc oxide (IZO) is provided on each two adjacent first transparent electrode portions and a link continuous to them, with an insulating layer intervening between the bridge wiring portion and the two first transparent electrode portions and link. These two adjacent second transparent electrode portions are electrically connected together by the bridge wiring portion. The thickness of the second transparent electrode portion TE and the thickness of the bridge wiring portion TB satisfy the following expressions: 0.28×TE+83 nm?TB?0.69×TE+105 nm; and 30 nm?TE?50 nm.
    Type: Application
    Filed: August 10, 2022
    Publication date: December 1, 2022
    Inventors: Manabu YAZAWA, Ken YAMAMURA, Sota TAKAHASHI
  • Patent number: 11194434
    Abstract: An input device includes a plurality of first transparent electrodes, a plurality of second transparent electrodes, coupling portions each electrically connecting two adjacent second transparent electrodes of the second transparent electrodes, and bridge portions each electrically connecting two adjacent first transparent electrodes of the first transparent electrodes. The first and second transparent electrodes are arranged in directions orthogonal to each other and are formed of a material containing conductive nanowires. The bridge portions each include a bridge wiring part, an insulating layer, and a buffer layer. The buffer layer is disposed between each of the coupling portions and the insulating layer. The buffer layer is formed of a light-transmissive, inorganic oxide-based material.
    Type: Grant
    Filed: August 13, 2020
    Date of Patent: December 7, 2021
    Assignee: Alps Alpine Co., Ltd.
    Inventors: Tomoyuki Yamai, Yasuyuki Kitamura, Manabu Yazawa, Ken Yamamura, Tomoya Kuwabara, Sota Takahashi
  • Publication number: 20200371642
    Abstract: An input device includes a plurality of first transparent electrodes, a plurality of second transparent electrodes, coupling portions each electrically connecting two adjacent second transparent electrodes of the second transparent electrodes, and bridge portions each electrically connecting two adjacent first transparent electrodes of the first transparent electrodes. The first and second transparent electrodes are arranged in directions orthogonal to each other and are formed of a material containing conductive nanowires. The bridge portions each include a bridge wiring part, an insulating layer, and a buffer layer. The buffer layer is disposed between each of the coupling portions and the insulating layer. The buffer layer is formed of a light-transmissive, inorganic oxide-based material.
    Type: Application
    Filed: August 13, 2020
    Publication date: November 26, 2020
    Inventors: Tomoyuki YAMAI, Yasuyuki KITAMURA, Manabu YAZAWA, Ken YAMAMURA, Tomoya KUWABARA, Sota TAKAHASHI