Patents by Inventor Sota TOKUI

Sota TOKUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESIVE TAPE AND PROCESSING METHOD
    Publication number: 20240010881
    Abstract: Provided is an adhesive tape having a base material layer and an adhesive layer disposed on the base material layer, wherein the adhesive layer contains a radical photoinitiator and polymer A having polymerizable carbon double bonds, and difference |R0-R1| between contact angle R0 of silicon wafer surface with respect to water and contact angle R1 of the silicon wafer surface with respect to water after the adhesive layer is attached to the silicon wafer, left to stand for 24 hours, then irradiated with ultraviolet ray, and peeled, is 20° or less.
    Type: Application
    Filed: October 20, 2021
    Publication date: January 11, 2024
    Applicant: Denka Company Limited
    Inventors: Chie NAKAMURA, Tomoaki TANAKA, Sota TOKUI, Mizuki HASUMI
  • ADHESIVE TAPE AND PROCESSING METHOD
    Publication number: 20230407149
    Abstract: Provided is an adhesive tape having a base material layer and an adhesive layer disposed on the base material layer, wherein the adhesive layer contains a radical photoinitiator and polymer A having polymerizable carbon double bonds, a tensile modulus of elasticity of the adhesive layer after ultraviolet irradiation is 400 MPa or less, and an elongation at break of the adhesive layer after ultraviolet irradiation is 16% or more.
    Type: Application
    Filed: October 20, 2021
    Publication date: December 21, 2023
    Applicant: Denka Company Limited
    Inventors: Chie NAKAMURA, Tomoaki TANAKA, Sota TOKUI, Mizuki HASUMI