Abstract: A resin composition comprising one or more cyanate compounds (A) selected from a group consisting of a naphthol aralkyl-based cyanate compound, a naphthylene ether-based cyanate compound, a xylene resin-based cyanate compound, a trisphenolmethane-based cyanate compound, and an adamantane skeleton-based cyanate compound; a polymaleimide compound (B) represented by general formula (1); and a filler (C).

Abstract: A resin composition for a printed wiring board including: a cyanate compound represented by the following general formula (1); and an epoxy resin,

Abstract: A resin composition for a printed wiring board containing a cyanate compound (A); a maleimide compound (B); and a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1): wherein R is a hydrogen atom or a substituent selected from a group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.

Abstract: The present invention is a cyanate ester compound represented by the following formula (1): wherein Ar represents an aromatic ring; R1 each independently represents a hydrogen atom, an alkyl group, or an aryl group; n each independently represents an integer of 1 to 3; m+n is the same as the total number of hydrogen atoms in a monovalent aromatic group containing the aromatic ring and the hydrogen atoms; R2 represents a hydrogen atom (excluding a case where Ar represents a benzene ring; n each represents 1; R1 represents a hydrogen atom; m each represents 4, and a cyanate group is bonded to the benzene ring in the 4-position relative to an adamantyl group), or an alkyl group having 1 to 4 carbon atoms; and R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.

Abstract: The present invention provides a resin composition comprising a cyanate compound (A); and an epoxy resin (B) represented by general formula (1): wherein a plurality of R each independently represent any of a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, and an alkoxy group having 1 to 6 carbon atoms.

Abstract: A resin composition comprising one or more cyanate compounds (A) selected from a group consisting of a naphthol aralkyl-based cyanate compound, a naphthylene ether-based cyanate compound, a xylene resin-based cyanate compound, a trisphenolmethane-based cyanate compound, and an adamantane skeleton-based cyanate compound; a polymaleimide compound (B) represented by general formula (1); and a filler (C).

Abstract: A resin composition for a printed wiring board containing a cyanate compound (A); a maleimide compound (B); and a benzoguanamine compound (C) having an aminomethyl group represented by the following general formula (1): wherein R is a hydrogen atom or a substituent selected from a group consisting of a hydrocarbon group having 1 to 10 carbon atoms, an alkoxyl group having 1 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, a hydroxyl group, an amide group, and a halogen atom, and n is an integer of 1 to 2.

Abstract: A resin composition for a printed wiring board including: a cyanate compound represented by the following general formula (1); and an epoxy resin,

Abstract: The present invention is a cyanate ester compound represented by the following formula (1): wherein Ar represents an aromatic ring; R1 each independently represents a hydrogen atom, an alkyl group, or an aryl group; n each independently represents an integer of 1 to 3; m+n is the same as the total number of hydrogen atoms in a monovalent aromatic group containing the aromatic ring and the hydrogen atoms; R2 represents a hydrogen atom (excluding a case where Ar represents a benzene ring; n each represents 1; R1 represents a hydrogen atom; m each represents 4, and a cyanate group is bonded to the benzene ring in the 4-position relative to an adamantyl group), or an alkyl group having 1 to 4 carbon atoms; and R3 represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms.

Abstract: A method for producing a colorless transparent resin film by a solution flow casting method containing: flow-casting an organic solvent solution of a polyamic acid or a polyimide on a support; and drying, the method containing at least the following step (1), step (2) and step (3) in this order, and an apparatus therefor: (1) a step of flow-casting an organic solvent solution of a polyamic acid or polyamide on a support, (2) a step of evaporating the organic solvent while blowing a gas having an oxygen content of from 0.001 to 15% by volume at a temperature of from 100 to 170° C. onto the flow-cast material, and releasing as a self-supporting film from the support, and (3) a step of performing the following step (3-1) and step (3-2) in this order: (3-1) a step of lowering a residual ratio of the organic solvent in the self-supporting film while blowing a gas having an oxygen content of 15% by volume or less at a temperature of from 100 to 250° C.

Abstract: A method for producing a colorless transparent resin film by a solution flow casting method containing: flow-casting an organic solvent solution of a polyamic acid or a polyimide on a support; and drying, the method containing at least the following step (1), step (2) and step (3) in this order, and an apparatus therefor: (1) a step of flow-casting an organic solvent solution of a polyamic acid or polyamide on a support, (2) a step of evaporating the organic solvent while blowing a gas having an oxygen content of from 0.001 to 15% by volume at a temperature of from 100 to 170° C. onto the flow-cast material, and releasing as a self-supporting film from the support, and (3) a step of performing the following step (3-1) and step (3-2) in this order: (3-1) a step of lowering a residual ratio of the organic solvent in the self-supporting film while blowing a gas having an oxygen content of 15% by volume or less at a temperature of from 100 to 250° C.

Abstract: In the process for producing an oxygen absorbing polyamide resin composition of the present invention, a diamine component containing 70 mol % or higher of m-xylylenediamine is polycondensed with a dicarboxylic acid component containing 50 mol % or higher of adipic acid in the presence of a phosphorus compound. A compound or complex containing at least one metal selected from the group consisting of transition metals of Group VIII of the Periodic Table, manganese, copper and zinc is added to reaction system either prior to initiation of the polycondensation reaction or during the polycondensation reaction such that a ratio (P/M) of a concentration of phosphorus P (mmol/g) in the phosphorus compound contained in the polyamide resin composition to a concentration of the metal M (mmol/g) in the polyamide resin composition is 0.02 to 1.0.

Abstract: In the process for producing an oxygen absorbing polyamide resin composition of the present invention, a diamine component containing 70 mol % or higher of m-xylylenediamine is polycondensed with a dicarboxylic acid component containing 50 mol % or higher of adipic acid in the presence of a phosphorus compound. A compound or complex containing at least one metal selected from the group consisting of transition metals of Group VIII of the Periodic Table, manganese, copper and zinc is added to reaction system either prior to initiation of the polycondensation reaction or during the polycondensation reaction such that a ratio (P/M) of a concentration of phosphorus P (mmol/g) in the phosphorus compound contained in the polyamide resin composition to a concentration of the metal M (mmol/g) in the polyamide resin composition is 0.02 to 1.0.