Abstract: There is provided a sensor including a sensor element, a substrate on which the sensor element is disposed, and a casing that accommodates the substrate. The casing has a doughnut shape, and has a connecting portion for externally connecting a wire. In a doughnut-shaped internal space of the casing, the substrate is disposed, and the wire is disposed in the connecting portion from a side of the substrate far from the connecting portion. A central cylinder portion is interposed between the substrate and the wire.

Abstract: There is provided a sensor including a sensor element, a substrate on which the sensor element is disposed, and a casing that accommodates the substrate. The casing has a doughnut shape, and has a connecting portion for externally connecting a wire. In a doughnut-shaped internal space of the casing, the substrate is disposed, and the wire is disposed in the connecting portion from a side of the substrate far from the connecting portion. A central cylinder portion is interposed between the substrate and the wire.

Abstract: Disclosed herein is a module, including: a circuit board; electronic components mounted on the circuit board; a mold resin that insulates and seals the electronic components; a shield conducting film that covers the outside of the mold resin; and shield conducting walls which are so formed in the mold resin as to divide the mold resin into a plurality of regions.

Abstract: A terminal apparatus updating method is disclosed which includes: performing a wireless power supply process of wirelessly supplying power to a terminal apparatus equipped with a wireless power reception portion so as to start up the terminal apparatus thus powered; performing a wireless transmission process of wirelessly transmitting firmware write data to the terminal apparatus started up in the wireless power supply process using a suitable wireless communication function; performing a write process of causing the terminal apparatus having received the firmware write data in the wireless transmission process to write the firmware write data to a storage portion inside the terminal apparatus; and stopping the wireless power supply process upon determination that the write process is completed.

Abstract: A wireless communication apparatus having a metal housing is provided, in which an outside antenna is not required and a small antenna the sensitivity of which does not decrease is included. A slit 1 is provided on a metal housing 5 of a wireless communication apparatus and a feeder 2 is connected to a position approximately three-quarters of the long side of the slit 1 to be used as a ?? slit antenna.

Abstract: A wiring board houses a bare radio-frequency IC. Shield wiring films are provided above and below the IC. A plurality of shield interlayer-connection conductor films, i.e., shield via-holes, is provided so as to surround the IC. The shield wiring films and the shield interlayer-connection conductor films define a shield cage, which can electrostatically shield the IC. Thus, there is no need to attach a shield cap.

Abstract: A wireless communication apparatus having a metal housing is provided, in which an outside antenna is not required and a small antenna the sensitivity of which does not decrease is included. A slit 1 is provided on a metal housing 5 of a wireless communication apparatus and a feeder 2 is connected to a position approximately three-quarters of the long side of the slit 1 to be used as a ?? slit antenna.

Abstract: A wiring board houses a bare radio-frequency IC. Shield wiring films are provided above and below the IC. A plurality of shield interlayer-connection conductor films, i.e., shield via-holes, is provided so as to surround the IC. The shield wiring films and the shield interlayer-connection conductor films define a shield cage, which can electrostatically shield the IC. Thus, there is no need to attach a shield cap.

Abstract: In a multi-layer wiring board having a strip line structure in which a grounding conductor wiring and a signal circuit wiring are disposed by interposing therebetween an insulation layer, the grounding conductor wiring is in the form of a grid and an open area ratio Rx [%]of the grid and a line width ratio Ry=Wg/Ws have a relationship expressed by Ry, .ltoreq.25.98.times.Rx.sup.-0.3871 -4.370 where Wg is the line width of the grounding conductor wiring, Sg is the width of an opening of the grid, Ws is the line width of the signal circuit wiring, and Rx={Sg/(Wg+Sg)}.sup.2 .times.100.