Abstract: An apparatus for transporting an electronic component includes a head for holding the component when the component is picked up from a suitable storage device. The head is movable relative to a base with an imaging apparatus being fixed to the head and allowing position of the component relative to the head to be determined while the component is being transported. A movable optical component is provided on the head which, in one position, contributes to defining an optical path between the component and the imaging apparatus, and in another position, is withdrawn. A further imaging apparatus may be provided, on the base or on the head with the further imaging apparatus detecting the position of large components, if the first imaging apparatus has a narrow filed of view for small components. Alternatively, when the further imaging apparatus is on the head, the imaging apparatus may detect the position to which the component is to be transported.

Abstract: Method and apparatus for detecting vertical and horizontal deformations of leads of a semiconductor device by illuminating the leads with a planar light beam and determining relative positions of the planar light beam on the leads on the basis of distribution of light rays reflected from the leads. Different lead deformations can be detected with one and the same mechanism within a short time. By applying the invention to a semiconductor device mounting apparatus, a single detector can be employed in common both for the detection of the semiconductor device position and the detection of reflections of the planar beam.

Abstract: An apparatus for inserting a plurality of kinds of electronic parts into a predetermined position of a printed board. An electronic part which is successively supplied from an electronic part supplying means is fed to a predetermined supply positioning end by a feeding means. An insertion unit carries the electronic part from this position to a predetermined specific position, thereby inserting the electronic part into the printed board. The printed board is held and positioned by an X-Y table. At a position corresponding to said specific position, the apparatus has a clinching means for clinching the leads of the electronic part which is inserted into the printed board and a control means which controls a predetermined operation of each means.

Abstract: A joint of a member joined by joining apparatus is tested by detecting an area of the joint and checking if the area has a predetermined value or not. A test apparatus includes an imaging device for imaging the joint on an image plane and converting the image to an electric signal and a processor for extracting the area of the joint from the electric signal from the imaging means to test the joint.