Patents by Inventor Sou HIMORI

Sou HIMORI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230174824
    Abstract: The adhesive tape, in which delamination hardly occurs even when a laminate layer is thin, includes: a base material 1 of a warp-knitted fabric in which a weft yarn 11 is inserted into a loop structure formed by a multifilament warp yarn 12; a first laminate layer 2 formed on a first surface 1A of the base material 1 where one warp yarn appears on the surface of the weft yarn; a second laminate layer 3 formed on a second surface 1B of the base material 1 on which two warp yarns appear on said weft yarn surface; and an adhesive layer 6 formed on the side of the first laminate layer 2.
    Type: Application
    Filed: April 27, 2021
    Publication date: June 8, 2023
    Applicant: TERAOKA SEISAKUSHO CO., LTD.
    Inventors: Mikio HOSOI, Sou HIMORI