Patents by Inventor Sou Kamimura

Sou Kamimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10248019
    Abstract: A pattern forming, method, includes: (i) forming a film from an actinic ray-sensitive or radiation-sensitive resin composition that contains (A) a compound capable of generating an acid upon irradiation with an actinic ray or radiation and decomposing by an action of an acid to decrease a solubility of the compound (A) for an organic solvent; (ii) exposing the film; and (iii) performing development by using a developer containing an organic solvent.
    Type: Grant
    Filed: December 21, 2012
    Date of Patent: April 2, 2019
    Assignee: FUJIFILM Corporation
    Inventors: Shohei Kataoka, Kaoru Iwato, Kana Fujii, Sou Kamimura, Yuichiro Enomoto, Keita Kato, Shuhei Yamaguchi
  • Patent number: 10126653
    Abstract: Provided is a method of forming a pattern, ensuring excellent sensitivity, limiting resolving power, roughness characteristic, exposure latitude (EL), dependence on post-exposure bake (PEB) temperature and focus latitude (depth of focus DOF), and a resist composition for use in the method. The method comprises (A) forming a film from a resist composition comprising a resin containing a repeating unit containing a group that is decomposed when acted on by an acid to thereby produce an alcoholic hydroxyl group, which resin thus when acted on by an acid decreases its solubility in a developer containing an organic solvent, (B) exposing the film to light, and (C) developing the exposed film using a developer containing an organic solvent.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: November 13, 2018
    Assignee: FUJIFILM Corporation
    Inventors: Kaoru Iwato, Shohei Kataoka, Shinji Tarutani, Sou Kamimura, Keita Kato, Yuichiro Enomoto, Kazuyoshi Mizutani, Toru Tsuchihashi, Kana Fujii
  • Patent number: 9897922
    Abstract: Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing an organic solvent, wherein the developer contains an alcohol compound (X) at a content of 0 to less than 500 ppm based on the total mass of the developer.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: February 20, 2018
    Assignee: FUJIFILM Corporation
    Inventors: Yuichiro Enomoto, Shinji Tarutani, Sou Kamimura, Kaoru Iwato, Keita Kato, Kana Fujii
  • Patent number: 9760003
    Abstract: Provided is a method of forming a pattern and an actinic-ray- or radiation-sensitive resin composition that excels in the limiting resolving power, roughness characteristics, exposure latitude (EL) and bridge defect performance. The method of forming a pattern includes (1) forming an actinic-ray- or radiation-sensitive resin composition into a film, (2) exposing the film to light, and (3) developing the exposed film with a developer containing an organic solvent. The actinic-ray- or radiation-sensitive resin composition contains (A) a resin containing a repeating unit with a structural moiety that is configured to decompose when exposed to actinic rays or radiation to thereby generate an acid, and (B) a solvent.
    Type: Grant
    Filed: May 20, 2011
    Date of Patent: September 12, 2017
    Assignee: FUJIFILM Corporation
    Inventors: Kaoru Iwato, Hidenori Takahashi, Shuji Hirano, Sou Kamimura, Keita Kato
  • Patent number: 9709892
    Abstract: Provided is an actinic-ray- or radiation-sensitive resin composition and a method of forming a pattern using the same, ensuring excellent the etching resistivity and the stability during a post-exposure delay (PED) period. The composition contains a resin containing a repeating unit containing a group that is decomposed when acted on by an acid to thereby produce an alcoholic hydroxyl group, and a compound that generates an acid of pKa??1.5 when exposed to actinic rays or radiation.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: July 18, 2017
    Assignee: FUJIFILM Corporation
    Inventors: Shohei Kataoka, Kaoru Iwato, Sou Kamimura, Toru Tsuchihashi, Yuichiro Enomoto, Kana Fujii, Kazuyoshi Mizutani, Shinji Tarutani, Keita Kato
  • Publication number: 20170102618
    Abstract: Provided is a method of forming pattern including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing a first organic solvent, wherein in the developer, particles each having a diameter of 0.3 ?m or greater amount to a density of 30 particles/ml or less.
    Type: Application
    Filed: December 21, 2016
    Publication date: April 13, 2017
    Applicant: FUJIFILM Corporation
    Inventors: Keita KATO, Sou KAMIMURA, Yuichiro ENOMOTO, Kaoru IWATO, Shohei KATAOKA, Shoichi SAITOH
  • Patent number: 9551935
    Abstract: Provided is a method of forming a pattern, ensuring excellent exposure latitude (EL) and focus latitude (depth of focus DOF). The method of forming a pattern includes (A) forming a film from a resist composition, the resist composition, (B) exposing the film to light, and (C) developing the exposed film using a developer containing an organic solvent, thereby forming a negative pattern. The resist composition contains (a) a resin that is configured to decompose when acted on by an acid and ?SP thereof represented by formula (1) below is 2.5 (MPa)1/2 or above, (b) a compound that is composed to generate an acid when exposed to actinic rays or radiation, and (c) a solvent.
    Type: Grant
    Filed: March 25, 2011
    Date of Patent: January 24, 2017
    Assignee: FUJIFILM Corporation
    Inventors: Keita Kato, Shinji Tarutani, Toru Tsuchihashi, Sou Kamimura, Yuichiro Enomoto, Kana Fujii, Kaoru Iwato, Shohei Kataoka, Kazuyoshi Mizutani
  • Patent number: 9513547
    Abstract: The pattern forming method of the present invention includes (i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition which contains a resin (A) which has a repeating unit including a group capable of generating a polar group by being decomposed due to an action of an acid and a repeating unit including a carboxyl group, a compound (B) which generates an acid according to irradiation with actinic rays or radiation, and a solvent (C); (ii) exposing the film using a KrF excimer laser, extreme ultraviolet rays, or an electron beam; and (iii) forming a negative tone pattern by developing the exposed film using a developer which includes an organic solvent.
    Type: Grant
    Filed: January 28, 2015
    Date of Patent: December 6, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Sou Kamimura, Hidenori Takahashi, Keita Kato
  • Publication number: 20160349620
    Abstract: Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing an organic solvent, wherein the developer contains an alcohol compound (X) at a content of 0 to less than 500 ppm based on the total mass of the developer.
    Type: Application
    Filed: August 12, 2016
    Publication date: December 1, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Yuichiro ENOMOTO, Shinji TARUTANI, Sou KAMIMURA, Kaoru IWATO, Keita KATO, Kana FUJII
  • Patent number: 9482958
    Abstract: Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing an organic solvent, wherein the developer contains an alcohol compound (X) at a content of 0 to less than 500 ppm based on the total mass of the developer.
    Type: Grant
    Filed: June 24, 2015
    Date of Patent: November 1, 2016
    Assignee: FUJIFILM Corporation
    Inventors: Yuichiro Enomoto, Shinji Tarutani, Sou Kamimura, Kaoru Iwato, Keita Kato, Kana Fujii
  • Publication number: 20160223905
    Abstract: This active light-sensitive or radiation-sensitive resin composition contains a resin (A), a compound (B) capable of generating an acid upon irradiation with active light or radiation, and a compound (C) having at least one oxygen atom. The compound (C) does not include the resin (A) and the compound (B).
    Type: Application
    Filed: April 7, 2016
    Publication date: August 4, 2016
    Applicant: FUJIFILM Corporation
    Inventors: Keiyu OU, Keita KATO, Michihiro SHIRAKAWA, Akiyoshi GOTO, Sou KAMIMURA
  • Publication number: 20160004156
    Abstract: There is provided a pattern forming method including: (1) filtering, by using a filter, a resin solution containing (A) a resin capable of increasing its polarity by an action of an acid to decrease solubility in a developer including an organic solvent, and (C1) a solvent; (2) preparing an actinic ray-sensitive or radiation-sensitive resin composition containing the resin (A) obtained from the filtrating (1) and a solvent (C2) different from the solvent (C1); (3) filtering the actinic ray-sensitive or radiation-sensitive resin composition by using a filter; (4) forming a film by using a filtrate obtained by the filtering (3); (5) exposing the film; and (6) performing development using a developer containing an organic solvent to form a negative pattern, wherein an absolute value of the difference between solubility parameter (SPC1) of the solvent (C1) and solubility parameter (SPDEV) of the developer (C1), |SPC1?SPDEV|, is 1.00 (cal/cm3)1/2 or less.
    Type: Application
    Filed: September 14, 2015
    Publication date: January 7, 2016
    Applicant: FUJIFILM CORPORATION
    Inventors: Shinichi SUGIYAMA, Sou KAMIMURA, Akiyoshi GOTO
  • Patent number: 9223219
    Abstract: Provided is a pattern forming method comprising (i) a step of forming a film from an actinic ray-sensitive or radiation-sensitive resin composition, (ii) a step of exposing the film, and (iii) a step of developing the exposed film by using an organic solvent-containing developer, wherein the actinic ray-sensitive or radiation-sensitive resin composition comprises (A) a resin capable of decreasing the solubility for an organic solvent-containing developer by the action of an acid, (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation, (D) a solvent, and (G) a compound having at least either one of a fluorine atom and a silicon atom and having basicity or being capable of increasing the basicity by the action of an acid.
    Type: Grant
    Filed: January 7, 2011
    Date of Patent: December 29, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Yuichiro Enomoto, Shinji Tarutani, Sou Kamimura, Kaoru Iwato, Keita Kato, Akinori Shibuya
  • Publication number: 20150293454
    Abstract: Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing an organic solvent, wherein the developer contains an alcohol compound (X) at a content of 0 to less than 500 ppm based on the total mass of the developer.
    Type: Application
    Filed: June 24, 2015
    Publication date: October 15, 2015
    Applicant: FUJIFILM Corporation
    Inventors: Yuichiro ENOMOTO, Shinji TARUTANI, Sou KAMIMURA, Kaoru IWATO, Keita KATO, Kana FUJII
  • Patent number: 9128376
    Abstract: A pattern forming method including: (i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition containing a resin (A) having a repeating unit having a group generating a polar group upon being decomposed by the action of an acid, and a repeating unit having an aromatic group, a compound (B) generating an acid upon irradiation with actinic rays or radiation, and a solvent (C); (ii) exposing the film; and (iii) developing the exposed film using a developer including an organic solvent to form a negative tone pattern, wherein the resin (A) is a resin having a repeating unit having a naphthyl group, and the like, and/or the actinic ray-sensitive or radiation-sensitive resin composition contains a compound (D) having a naphthalene ring, and the like.
    Type: Grant
    Filed: May 16, 2014
    Date of Patent: September 8, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Keita Kato, Michihiro Shirakawa, Hidenori Takahashi, Sou Kamimura
  • Patent number: 9116437
    Abstract: A pattern forming method, including: (i) forming a film from a chemical amplification resist composition; (ii) exposing the film, so as to form an exposed film; and (iii) developing the exposed film by using a developer containing an organic solvent, wherein the chemical amplification resist composition contains: (A) a resin capable of decreasing a solubility of the resin (A) in the developer containing an organic solvent by an action of an acid; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; and (C) a basic, compound or ammonium salt compound whose basicity decreases upon irradiation with an actinic ray or radiation, and a resist composition used for the pattern forming method and a resist film formed from the resist composition are provided.
    Type: Grant
    Filed: June 14, 2010
    Date of Patent: August 25, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Yuichiro Enomoto, Sou Kamimura, Shinji Tarutani
  • Patent number: 9097973
    Abstract: Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, and (c) developing the exposed film with a developer containing an organic solvent, wherein the developer contains an alcohol compound (X) at a content of 0 to less than 500 ppm based on the total mass of the developer.
    Type: Grant
    Filed: June 29, 2011
    Date of Patent: August 4, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Yuichiro Enomoto, Shinji Tarutani, Sou Kamimura, Kaoru Iwato, Keita Kato, Kana Fujii
  • Publication number: 20150147699
    Abstract: The pattern forming method of the present invention includes (i) forming a film using an actinic ray-sensitive or radiation-sensitive resin composition which contains a resin (A) which has a repeating unit including a group capable of generating a polar group by being decomposed due to an action of an acid and a repeating unit including a carboxyl group, a compound (B) which generates an acid according to irradiation with actinic rays or radiation, and a solvent (C); (ii) exposing the film using a KrF excimer laser, extreme ultraviolet rays, or an electron beam; and (iii) forming a negative tonetone pattern by developing the exposed film using a developer which includes an organic solvent.
    Type: Application
    Filed: January 28, 2015
    Publication date: May 28, 2015
    Applicant: FUJIFILM CORPORATION
    Inventors: Sou KAMIMURA, Hidenori TAKAHASHI, Keita KATO
  • Patent number: 8999621
    Abstract: A pattern forming method includes: (i) forming a film from a chemical amplification resist composition; (ii) exposing the film, so as to form an exposed film; and (iii) developing the exposed film by using an organic solvent-containing developer, wherein the chemical amplification resist composition contains: (A) a resin substantially insoluble in alkali; (B) a compound capable of generating an acid upon irradiation with an actinic ray or radiation; (C) a crosslinking agent; and (D) a solvent, a negative chemical amplification resist composition used in the method, and a resist film formed from the negative chemical amplification resist composition.
    Type: Grant
    Filed: October 5, 2010
    Date of Patent: April 7, 2015
    Assignee: FUJIFILM Corporation
    Inventors: Yuichiro Enomoto, Sou Kamimura, Shinji Tarutani, Keita Kato, Kaoru Iwato
  • Patent number: 8871642
    Abstract: Provided is a method of forming a pattern, including (a) forming a chemically amplified resist composition into a film, (b) exposing the film to light, (c) developing the exposed film with a developer containing an organic solvent, and (d) rinsing the developed film with a rinse liquid containing an organic solvent, which rinse liquid has a specific gravity larger than that of the developer.
    Type: Grant
    Filed: August 26, 2011
    Date of Patent: October 28, 2014
    Assignee: FUJIFILM Corporation
    Inventors: Yuichiro Enomoto, Shinji Tarutani, Sou Kamimura, Keita Kato, Kana Fujii