Abstract: Disclosed herein are apparatus for a cooler device includes a manifold constructed at least partially of silicon oxide. The manifold includes an array of inlet channels and an array of outlet channels. Each inlet channel has a first depth. The array of outlet channels are interlaced with the array of inlet channels, Each outlet channel has a second depth that is larger than the first depth. Each of the array of outlet channels has a pair of sidewalls separating each outlet channel from adjacent inlet channels of the array of inlet channels.

Abstract: Improved microchannel structures are provided using monolithic structures having deep features (?150 um) and two or more different feature heights above the substrate. Exemplary channel structures that are enabled by this approach include step-tapered V-groove channels, channels having various kinds of lithographically define roughness, and channels having an arbitrarily defined depth along their length.

Abstract: Improved vapor chambers are provided using monolithic wick structures having deep features (?150 um) and two or more different feature heights above the substrate. Such monolithic multi-level wick structures provide improved performance in vapor chambers by alleviating the tradeoff between fluid transport (which favors tall pin-fins) and heat transfer (which favors short pin-fins).

Abstract: A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

Abstract: A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.

Abstract: We provide a novel cleanroom-based process flow that allows for easy creation of multi-level, hierarchical 3D structures in a substrate. This is achieved by introducing an ultra-thin sacrificial hardmask layer on the substrate which is first 3D patterned via multiple rounds of lithography. This 3D pattern is then scaled vertically by a factor of 200 - 300 and transferred to the substrate underneath via a single shot deep etching step. This method is also easily characterizable - using features of different topographies and dimensions, the etch rates and selectivities were quantified; this characterization information was later used while fabricating specific target structures.