Patents by Inventor Souhei Horiuchi

Souhei Horiuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of plating and method of manufacturing a micro device
    Patent number: 7854829
    Abstract: A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality of layers. Accordingly, a value of plating-current density is easily maintained constant without any special operation. Consequently, the plating patterns in each of the plurality of layers is easily formed to have an uniform composition.
    Type: Grant
    Filed: June 15, 2007
    Date of Patent: December 21, 2010
    Assignee: TDK Corporation
    Inventors: Akifumi Kamijima, Atsushi Yamaguchi, Masahiro Saito, Shingo Miyata, Yuji Otsubo, Souhei Horiuchi
  • Method of plating and method of manufacturing a micro device
    Publication number: 20080006537
    Abstract: A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality of layers. Accordingly, a value of plating-current density is easily maintained constant without any special operation. Consequently, the plating patterns in each of the plurality of layers is easily formed to have an uniform composition.
    Type: Application
    Filed: June 15, 2007
    Publication date: January 10, 2008
    Applicant: TDK CORPORATION
    Inventors: Akifumi Kamijima, Atsushi Yamaguchi, Masahiro Saito, Shingo Miyata, Yuji Otsubo, Souhei Horiuchi