Patents by Inventor Souhei Samejima

Souhei Samejima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed circuit board and method of manufacturing the same
    Patent number: 8148647
    Abstract: An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs (2a) and (2b) being cured after each covering the surfaces of a metal plate (1) provided with first throughholes (1a) therein and the inner walls of the first throughholes (1a); prepregs (4a) and (4b) being cured after glass clothes (3a) and (3b) are sandwiched between the prepregs (2a) and (2b), and the prepregs (4a) and (4b), respectively; and second throughholes (8) that connect wiring layers (7a) and (7c), and (7b) and (7d) provided on both surfaces of prepregs (6a) and (6b), respectively. The prepregs (2a) and (2b) and the prepregs (4a) and (4b) are characterized in that they contain inorganic filler. Furthermore, the prepregs (2a) and (2b) and the prepregs (4a) and (4b) may contain elastomer.
    Type: Grant
    Filed: August 1, 2007
    Date of Patent: April 3, 2012
    Assignee: Mitsubishi Electric Corporation
    Inventors: Souhei Samejima, Sadao Sato, Hiroyuki Osuga, Shigeru Utsumi, Teruhiko Kumada
  • PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20080047742
    Abstract: An object of the invention is to provide a printed circuit board that has an excellent heat dissipation performance and excellent reliability, and its manufacturing method. The printed circuit board includes: prepregs (2a) and (2b) being cured after each covering the surfaces of a metal plate (1) provided with first throughholes (1a) therein and the inner walls of the first throughholes (1a); prepregs (4a) and (4b) being cured after glass clothes (3a) and (3b) are sandwiched between the prepregs (2a) and (2b), and the prepregs (4a) and (4b), respectively; and second throughholes (8) that connect wiring layers (7a) and (7c), and (7b) and (7d) provided on both surfaces of prepregs (6a) and (6b), respectively. The prepregs (2a) and (2b) and the prepregs (4a) and (4b) are characterized in that they contain inorganic filler. Furthermore, the prepregs (2a) and (2b) and the prepregs (4a) and (4b) may contain elastomer.
    Type: Application
    Filed: August 1, 2007
    Publication date: February 28, 2008
    Applicant: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Souhei SAMEJIMA, Sadao Sato, Hiroyuki Osuga, Shigeru Utsumi, Teruhiko Kumada