Abstract: An electronic parts mounting apparatus using a band carrier for feeding electronic parts incrementally, the carrier being a strip having many recesses disposed at equal intervals each holding an electronic part and a tape covering the recesses. The apparatus has a support for horizontally supporting the carrier with the coating tape on the top side, a separator for separating the tape from the carrier; and a pick up device for picking up the electronic parts one-by-one from the recesses in the carrier and carrying the electronic parts and placing them in position on a circuit board for continuously and stably mounting the electronic parts on the circuit board.

Abstract: An apparatus for carrying electronic components from a supply position to an electronic circuit board or the like and placing the electronic components on the electronic circuit board or the like, which has a rod provided at its tip end with a suction tool for picking up components to be carried and which is connected with an air suction apparatus; a body frame supporting the rod for movement of the rod in the vertical and horizontal directions; two pairs of position regulating pawls which are movably supported on the rod and are supported for freely opening and closing to grasp the components from different directions which the components are held by the suction tool and positioning them; and an arrangement for opening and closing the position regulating pawls.

Abstract: A process for mounting electronic parts of very small size on electronic circuit boards or substrates, in which the substrates are maintained in predetermined relative positions, and a dispenser unit dispensing a bonding material for bonding the electronic parts to each of the substrates, a mounting unit mounting the electronic parts on each of the substrates, and/or an inspecting unit inspecting the position and/or the electrical properties of the electronic parts mounted on each of the substrates are disposed in the same relative positions as those of the substrates to carry out their individual functions on the associated substrates, so that the electronic parts can be efficiently and rationally mounted on the substrates.