Abstract: An upright electric cleaning device includes a floor suction tool formed with a long suction opening on the bottom surface thereof. A rotating brush holding chamber holds a rotating brush that extends to this long suction opening. A suction opening leading to the main cleaning device unit is formed toward one end of the rear wall of the rotating brush holding chamber. A rib, formed on the upper section of the rotating brush holding chamber, extends along the length of the rotating brush, near the rotation path of the rotating brush. An air current path is formed to take dust drawn up by the rotating brush and stopped by the rib and suck it into the suction opening leading to the main cleaning device unit. The air current path is shaped so that its cross section is smaller at an end of the air current path remote from the suction opening than it is near the suction opening to increase flow speed at the remote end.

Abstract: A dust-collecting device for a vacuum cleaner comprising a dust-collecting case which is fitted into a suction path extending from a suction nozzle to a motor fan and from which accumulated dust can be discharged by opening a bottom lid of the dust-collecting case, and a cylindrical filter fitted into the dust-collecting case. The filter is arranged to be rotatable, a spiral rib is formed at an outer periphery of the filter, and the device is equipped with a rotating means for rotating the filter. Dust which cannot be discharge by its own weight since it is in a compressed state can be pushed out through the spiral rib formed on the outer periphery of the filter by rotating the filter, so that dust accumulated within the dust-collecting case in a compressed state can be easily discharged.

Abstract: A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.

Abstract: A device for changing and attaching or mounting an angle of stationary vanes of an axial-flow fluid machine by rotating the stationary vanes through a circumferential movement of an intermediate cylinder. The device includes at least one arm secured to one end of the intermediate cylinder and engaging at a second end in a groove formed in a block member which is attached to an end of an actuator and is movable in a tangential direction of the intermediate cylinder. A guide arrangement is provided for guiding a movement of the block member and at least a portion of the actuator so as to ensure a smooth operation of the actuator by freeing the same from any influence of undesireable forces such as lateral pressure caused by a thermal expansion of the intermediate cylinder.

Abstract: A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.